Attribute | Value |
---|---|
PCB Thickness | 0.6mm |
Soldermask | Green, blue, yellow, red, etc. |
Min. Line Width/Spacing | 0.075mm/0.075mm |
Shield | Copper |
Min. Bend Radius | 0.5mm |
Copper Thickness | 1Oz |
Material | FR-4, Polyimide |
PCB board name: Rigid-flex PCB fabrication
Brand: ONESEINE
Material: Fr4+flex
Thickness: Rigid 1.2MM, Flex 0.6mm
Surface: Immersion gold
The combination of FPC and PCB technologies has led to the development of rigid-flex boards, which incorporate the characteristics of both flexible and rigid circuit boards through specialized laminating processes.
Rigid-flex board manufacturing requires both FPC and PCB production equipment. The process begins with electronic engineers designing the circuit and layout, followed by CAM processing and production planning. After separate fabrication of the FPC and PCB components, they are precisely aligned and laminated using specialized press equipment, followed by thorough quality inspection due to the high value of these components.
Rigid-flex PCBs combine rigid (typically FR4) and flexible (polyimide) materials, offering structural support in rigid areas while allowing bending in flexible sections. This hybrid construction provides significant advantages: