PI FR4 BGA QFN Quick Turn Flex PCB FPC Board Single Sided 10 Layer
Product Specifications
Attribute |
Value |
Product attributes |
14,Array,Blue,ENIG,Array |
Applications |
Test & Measurement |
Stiffener |
TG 150°C FR4 Blue |
Raw Material |
PI + FR-4 |
Assembly Option |
Yes |
Surface Mount Technology |
BGA, QFN, 0201 |
10 Layer Fast Turn Rigid Semi Flex PCB Flex Circuit
Product category: Rigid and flex combination board
Basic Parameters
- Type: 14-layer soft and hard combination plate (buried blind hole plate)
- Size: 88 * 64mm
- Plate structure: 6L hard plate + 4L soft plate + 4L hard plate
- Copper thickness: 18um
- Plate thickness: PCB=1.6mm ± 0.1mm / FPC=0.18mm ± 0.03mm
- Hole size: through hole 0.2mm, buried hole 0.1mm, blind hole 0.1mm
FPC Manufacturing
Flexible printed circuits (FPC) are manufactured using photolithographic technology, offering advantages for tight assemblies, dynamic applications, and space-constrained designs. These circuits are ideal for applications requiring 3D electrical connections or frequent flexing.
Circuit Types
Single-sided flex PCB circuits: Feature a single conductor layer on flexible dielectric film, commonly used in transparent LED films and automotive lighting.
Double-sided flex PCB circuits: Contain two conductor layers with plated through holes, enabling component placement on both sides and easy crossover connections.
Multilayer flex PCB circuits: Consist of three or more conductor layers, offering design flexibility through discontinuous lamination in bending areas.
Rigid-flex PCB circuits: Hybrid constructions combining rigid and flexible substrates into a single structure, providing superior reliability and space efficiency for complex applications.
Rigid-Flex PCB Advantages
- Significant space reduction by eliminating connectors and cables
- Enhanced reliability with fewer interconnects and solder joints
- Improved signal integrity through optimized routing
- Greater design flexibility for complex geometries
- Superior resistance to vibration and thermal stress
