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Vurgulamak
ISOLA bga circuit board
,6mm bga circuit board
,ISOLA low volume pcb assembly
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Ürün AçıklamasıIsola PCB Yüksek TG PCB ISOLA 370HR PCB HF PCB
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MalzemeIsola PCB malzemesi
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Kurşun zamanı3-5 gün
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KökenShenzhen
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PCB StandardıIPC-A-610 D/IPC-III Standardı
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Tahta kalınlığı0.2mm-6.0mm
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Elektronik kaynağıEvet
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Bakır1 oz
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Place of OriginShenzhen,China
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Marka adıONESEINE
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SertifikaISO9001,ISO14001
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Model NumberONE-102
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Minimum Order Quantity1pcs
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FiyatUSD0.1-1000
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Packaging DetailsVacuun bag
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Delivery Time5-8 working days
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Payment TermsT/T,Western Union
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Supply Ability1000000000pcs/mon
ISOLA High TG PCB 370HR Material 0.2mm-6mm Board Thickness
| Attribute | Value |
|---|---|
| Product Description | ISOLA PCB High TG PCB ISOLA 370HR PCB HF PCB |
| Material | ISOLA PCB material |
| Lead Time | 3-5 days |
| Origin | Shenzhen |
| PCB Standard | IPC-A-610 D/IPC-III Standard |
| Board Thickness | 0.2mm-6.0mm |
| Electronics Source | Yes |
| Copper | 1 oz |
- Size: 18*10cm
- Copper THK: 35UM
- Color: Green
- Material: Isola laminate
- Surface finish: Immersion gold, ENIG
- 6 layer 1.2mm thickness
- Green solder mask, white silk screen
- Line space and width: 10mil
- Certification: ISO9001/SGS/UL
- Delivery time: 3-7 working days
We maintain stock of scarce ISOLA 370HR material, reducing incoming material time and saving costs for you.
ISOLA substrate is a high performance 180°C glass transition temperature (Tg) FR-4 system for multilayer Printed Wiring Board (PWB) applications requiring maximum thermal performance and reliability. 370HR laminate and prepreg products use a unique high performance multifunctional epoxy resin reinforced with electrical grade (E-glass) glass fabric.
This system provides improved thermal performance and low expansion rates compared to traditional FR-4 while maintaining FR-4 processability. Mechanical, chemical and moisture resistance properties equal or exceed traditional FR-4 materials. The 370HR system is laser fluorescing and UV blocking for maximum compatibility with Automated Optical Inspection (AOI) systems, optical positioning systems and photoimagable solder mask imaging.
370HR has proven best in class for sequential lamination.
- High Thermal Performance
- Tg: 180°C (DSC)
- Td: 360°C (TGA @ 5% wt loss)
- T260: 60 minutes
- T288: 15 minutes
- RoHS Compliant
- UV Blocking and AOI Fluorescence
- High throughput and accuracy during PCB fabrication and assembly
- Superior Processing
- Closest to conventional FR-4 processing of all high speed materials
- Core Material Standard Availability
- Thickness: 0.002" (0.05 mm) to 0.125" (3.2 mm)
- Available in full size sheet or panel form
- Prepreg Standard Availability
- Roll or panel form
- Tooling of prepreg panels available
- Copper Foil Type Availability
- Standard HTE Grade 3
- RTF (Reverse Treat Foil)
- Copper Weights
- 1 and 2 oz (18, 35 and 70 μm) available
- Heavier copper available upon request
- Thinner copper foil available upon request
- Glass Fabric Availability
- Standard E-glass
- Square weave glass fabric available
- Industry Approvals
- IPC-4101D WAM1 /24 /121 /124
- UL - File Number E41625
- Qualified to UL's MCIL Program
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