Rogers 4350B Multilayer Circuit Board FR4 Hybrid PCB With ENIG Surface Finish
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Vurgulamak
Ro4350B multilayer circuit board
,Ceramic multilayer circuit board
,Ro4350B pcb motherboard
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MalzemeFr4, Rogers, Rogers 4350B, Keramik
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Katmanlar4
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TipHibrit Yükleme
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YüzeyDaldırma altın
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ROHS uyumluEvet
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Bakır1 oz
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Place of OriginShenzhen,China
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Marka adıONESEINE
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SertifikaISO9001,ISO14001
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Model NumberONE-102
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Minimum Order Quantity1pcs
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FiyatUSD0.1-1000
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Packaging DetailsVacuun bag
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Delivery Time5-8 working days
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Payment TermsT/T,Western Union
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Supply Ability1000000000pcs/mon
Rogers 4350B Multilayer Circuit Board FR4 Hybrid PCB With ENIG Surface Finish
| Attribute | Value |
|---|---|
| Material | Fr4, Rogers, Rogers 4350B, Ceramic |
| Layers | 4 |
| Type | Hybrid Stack up Board |
| Surface | Immersion Gold |
| Rohs Compliant | Yes |
| Copper Thickness | 1OZ |
| Name: | Ro4350 Ceramic Hybrid High Frequency Board | Thickness: | 1.0mm |
| Material: | Ro4350B + FR4 | Layers: | 4 |
| Copper: | 1oz | Flammability: | 94V-0 |
| Core: | 0.762mm | DK: | 3.48 |
| Volume resistivity: | 1.2*1010 | Surface resistivity: | 5.7*109 |
| Thermal conductivity: | 0.69w/m.k | Density: | 1.9gm/cm3 |
| Surface finish: | ENIG | Application: | RF, microwave antenna |
With the rapid development of 5G technology, there is growing demand for high-frequency PCBs and RF PCBs that offer low electrical noise and minimal signal losses. Rogers PCB material provides an ideal solution that combines performance with cost-effectiveness.
- Automotive Radar and Sensors
- Microwave equipment of all kinds
- Cellular Base Station Antennas
- RF Identification (RFID) Tags
- 5G Stations
- Microwave point to point (P2P) links
- LNB's for Direct Broadcast Satellites
RO4350B ceramic-filled hydrocarbon laminate delivers superior RF performance:
- Ultra-stable Dk: 3.48±0.05 from 1-40GHz
- Near-zero loss: Df=0.0037 @ 10GHz (1/5th of FR-4)
- Enhanced thermal management: 0.69 W/mK conductivity (3× FR-4)
Real-world benefits include 45% lower signal loss in 5G mMIMO antenna arrays and 18°C lower temperatures in power amplifiers compared to FR-4 hybrids.
Hybrid stackup designs combine RO4350B with FR-4 for optimal performance and cost efficiency:
- Signal layers: RO4350B for RF traces (ensures impedance control)
- Power/ground planes: FR-4 for DC routing (reduces costs by up to 25%)
Advanced manufacturing techniques like Laser Direct Imaging and plasma desmear ensure high yields and consistent quality.
- RF Engineering Director, Top-3 Telecom OEM
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