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ONESEINE TECHNOLOGY CO.,LTD 86-757-86226896 sales@oneseine.com
SMT PCB Assembly Service 0.5oz-3oz FR4 with Functional Testing

SMT PCB Assembly Service 0.5oz-3oz FR4 with Functional Testing

  • Vurgulamak

    3oz pcb board assembly manufacturing

    ,

    0.5oz pcb board assembly manufacturing

    ,

    0.5oz surface mount pcb assembly

  • PCB Montaj Yöntemi
    SMT
  • Test hizmeti
    Fonksiyon testi,% 100 test
  • PCB Testi
    PCB Testingyes
  • İç cu ağırlığı
    0.5-3 0Z
  • Min
    0.075mm
  • Delik Boyutu
    0,3 mm
  • Üretim süreci
    SMD+DIP
  • Katman sayısı
    1-48
  • Place of Origin
    Shenzhen,China
  • Marka adı
    ONESEINE
  • Sertifika
    ISO9001,ISO14001
  • Model Number
    ONE-102
  • Minimum Order Quantity
    1pcs
  • Fiyat
    USD0.1-1000
  • Packaging Details
    Vacuun bag
  • Delivery Time
    5-8 working days
  • Payment Terms
    T/T,Western Union
  • Supply Ability
    1000000000pcs/mon

SMT PCB Assembly Service 0.5oz-3oz FR4 with Functional Testing

0.5oz-3oz Surface Mount SMD DIP PCB Board Assembly Manufacturing
Product Specifications
Attribute Value
PCB Assembly Method SMT
Testing Service Function Test, 100% Test
PCB Testing Yes
Inner Cu Weight 0.5-3 oz
Min Line 0.075mm
Hole Size 0.3mm
Production Process SMD+DIP
Number Of Layers 1-48
High Level FR4 PCBA Case Service

Providing full-scale solutions for complex circuit boards with professional manufacturing capabilities.

General PCBA Information
  • Base material: FR4 epoxy resin
  • Board thickness: 1.6mm
  • Surface finish: Immersion gold
  • Board size: 7.2*17.3CM
  • Copper thickness: 1OZ
  • Solder mask and silkscreen: green and white
  • Components sourcing: available
Production Capabilities
  • Type of Assembly: SMT, DIP & THT
  • Solder Type: Water Soluble Solder Paste, Leaded and Lead-Free
  • Components: Passive down to 0201 size; BGA and VFBGA; Leadless Chip Carriers/CSP
  • Bare Board Size: Smallest 0.25*0.25 inches to Largest 20*20 inches
  • File Formats Accepted: Bill of Materials, Gerber files, Pick-N-Place file
  • Service Types: Turn-key, partial turn-key or consignment
  • Component Package: Cut Tape, Tube, Reels, Loose Parts
  • Turn Time: Same day service to 15 days service
  • Testing: Flying Probe Test, X-ray Inspection, AOI Test
  • PCBA Process: SMT → Wave Soldering → Assembling → ICT → Function Testing
Advanced PCBA Capabilities
  • SMT, PTH, mixed technology assembly
  • SMT capacity: 2,000,000 solder joints per day
  • DIP capacity: 300,000 joints per day
  • Ultra fine pitch, QFP, BGA, μBGA, CBGA assembly
  • Advanced SMT assembly technology
  • Automated insertion of PTH components
  • Cleanable, aqueous and lead-free processing
  • RF manufacturing expertise
  • Press fit back planes & mid planes
  • Device programming services
  • Automated conformal coating
Testing Equipment
  • Universal Tester
  • Flying Probe Open/Short Tester
  • High power Microscope
  • Solderability Testing Kit
  • Peel Strength tester
  • High Volt Open & Short tester
  • Cross Section Molding Kit With Polisher
Technical Requirements for PCB Assembly
  • Professional Surface-mounting and Through-hole soldering Technology
  • Various component sizes (1206, 0805, 0603, 0402, 0201) SMT technology
  • ICT (In Circuit Test) and FCT (Functional Circuit Test) technology
  • PCB Assembly with UL, CE, FCC, Rohs Approval
  • Nitrogen gas reflow soldering technology for SMT
  • High Standard SMT & Solder Assembly Line
  • High density interconnected board placement technology capacity
Quote Requirements
  • Gerber file and BOM list (Gerber, PCB, Eagle or CAD files accepted)
  • Clear photos of PCBA or PCBA sample for reference
  • Test method specifications for PCBA to ensure 100% quality
Assembly Capabilities
  • Printed Circuit Board Assembly (PCBA)
  • Through Hole assembly
  • Surface Mount (SMT) assembly
  • PCB Handling up to 400mm x 500mm
  • RoHS Compliance Production
  • Non RoHS Production (where permitted)
  • Automated Optical Inspection (AOI)
Component Technologies
  • Passive components down to 0201 size
  • BGA and VFBGA assembly
  • Leadless Chip Carriers/CSP
  • Fine Pitch to 0.8mils
  • BGA Repair and Reball services
  • Part Removal and Replacement
SMT PCB Assembly Service 0.5oz-3oz FR4 with Functional Testing 0