0.5oz-3oz Surface Mount SMD DIP PCB Board Assembly Manufacturing
Product Specifications
Attribute |
Value |
PCB Assembly Method |
SMT |
Testing Service |
Function Test, 100% Test |
PCB Testing |
Yes |
Inner Cu Weight |
0.5-3 oz |
Min Line |
0.075mm |
Hole Size |
0.3mm |
Production Process |
SMD+DIP |
Number Of Layers |
1-48 |
High Level FR4 PCBA Case Service
Providing full-scale solutions for complex circuit boards with professional manufacturing capabilities.
General PCBA Information
- Base material: FR4 epoxy resin
- Board thickness: 1.6mm
- Surface finish: Immersion gold
- Board size: 7.2*17.3CM
- Copper thickness: 1OZ
- Solder mask and silkscreen: green and white
- Components sourcing: available
Production Capabilities
- Type of Assembly: SMT, DIP & THT
- Solder Type: Water Soluble Solder Paste, Leaded and Lead-Free
- Components: Passive down to 0201 size; BGA and VFBGA; Leadless Chip Carriers/CSP
- Bare Board Size: Smallest 0.25*0.25 inches to Largest 20*20 inches
- File Formats Accepted: Bill of Materials, Gerber files, Pick-N-Place file
- Service Types: Turn-key, partial turn-key or consignment
- Component Package: Cut Tape, Tube, Reels, Loose Parts
- Turn Time: Same day service to 15 days service
- Testing: Flying Probe Test, X-ray Inspection, AOI Test
- PCBA Process: SMT → Wave Soldering → Assembling → ICT → Function Testing
Advanced PCBA Capabilities
- SMT, PTH, mixed technology assembly
- SMT capacity: 2,000,000 solder joints per day
- DIP capacity: 300,000 joints per day
- Ultra fine pitch, QFP, BGA, μBGA, CBGA assembly
- Advanced SMT assembly technology
- Automated insertion of PTH components
- Cleanable, aqueous and lead-free processing
- RF manufacturing expertise
- Press fit back planes & mid planes
- Device programming services
- Automated conformal coating
Testing Equipment
- Universal Tester
- Flying Probe Open/Short Tester
- High power Microscope
- Solderability Testing Kit
- Peel Strength tester
- High Volt Open & Short tester
- Cross Section Molding Kit With Polisher
Technical Requirements for PCB Assembly
- Professional Surface-mounting and Through-hole soldering Technology
- Various component sizes (1206, 0805, 0603, 0402, 0201) SMT technology
- ICT (In Circuit Test) and FCT (Functional Circuit Test) technology
- PCB Assembly with UL, CE, FCC, Rohs Approval
- Nitrogen gas reflow soldering technology for SMT
- High Standard SMT & Solder Assembly Line
- High density interconnected board placement technology capacity
Quote Requirements
- Gerber file and BOM list (Gerber, PCB, Eagle or CAD files accepted)
- Clear photos of PCBA or PCBA sample for reference
- Test method specifications for PCBA to ensure 100% quality
Assembly Capabilities
- Printed Circuit Board Assembly (PCBA)
- Through Hole assembly
- Surface Mount (SMT) assembly
- PCB Handling up to 400mm x 500mm
- RoHS Compliance Production
- Non RoHS Production (where permitted)
- Automated Optical Inspection (AOI)
Component Technologies
- Passive components down to 0201 size
- BGA and VFBGA assembly
- Leadless Chip Carriers/CSP
- Fine Pitch to 0.8mils
- BGA Repair and Reball services
- Part Removal and Replacement