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Vurgulamak
ISO9001 printed circuit board pcba
,epoxy resin printed circuit board pcba
,resin quick turn printed circuit boards
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Maksimum PCB boyutu700 × 460mm
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Katman sayısı1-48
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Empedans kontrolüEvet
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SertifikalarISO 9001, ISO 14001, ROHS, UL
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Daha kalın bakır0.5-10 oz
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Tahta kesmeKesme, V-Skoru, Sekme ile Saya Çıktı
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Place of OriginShenzhen,China
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Marka adıONESEINE
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SertifikaISO9001,ISO14001
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Model NumberONE-102
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Minimum Order Quantity1pcs
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FiyatUSD0.1-1000
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Packaging DetailsVacuun bag
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Delivery Time5-8 working days
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Payment TermsT/T,Western Union
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Supply Ability1000000000pcs/mon
ISO Certified 1-48 Layer PCB Assembly with Immersion Gold Finish
ISO9001 Epoxy Resin Quick Turn Printed Circuit Board PCBA Immersion Gold 1-48 Layers
Product Specifications
| Attribute | Value |
|---|---|
| Max PCB Size | 700 × 460mm |
| Number Of Layers | 1-48 |
| Impedance Control | Yes |
| Certifications | ISO 9001, ISO 14001, RoHS, UL |
| Thicker Copper | 0.5-10OZ |
| Board Cutting | Shear, V-Score, Tab-Routed, Counter Sunk |
Full-Scale PCB Assembly Solutions for Complex Circuit Boards
General PCBA Information
Base material: FR4 epoxy resin
Board thickness: 1.6mm
Surface finish: Immersion gold
Board size: 7.2*17.3CM
Copper thickness: 1OZ
Solder mask and silkscreen: green and white
Components sourcing: yes
Board thickness: 1.6mm
Surface finish: Immersion gold
Board size: 7.2*17.3CM
Copper thickness: 1OZ
Solder mask and silkscreen: green and white
Components sourcing: yes
Technical Requirements for PCB Assembly
- Professional Surface-mounting and Through-hole soldering Technology
- Various sizes like 1206,0805,0603,0402,0201 components SMT technology
- ICT (In Circuit Test), FCT (Functional Circuit Test) technology
- PCB Assembly With UL, CE, FCC, Rohs Approval
- Nitrogen gas reflow soldering technology for SMT
- High Standard SMT & Solder Assembly Line
- High density interconnected board placement technology capacity
Production Capabilities
| Quantity | Prototype & Low Volume PCB Assembly & Mass production (without MOQ) |
|---|---|
| Type of Assembly | SMT, DIP & THT |
| Solder Type | Water Soluble Solder Paste, Leaded and Lead-Free |
| Components | Passive Down to 0201 size; BGA and VFBGA; Leadless Chip Carriers/CSP |
| Bare Board Size | Smallest: 0.25*0.25 inches; Largest: 20*20 inches |
| File Format | Bill of Materials; Gerber files; Pick-N-Place file |
| Types of Service | Turn-key, partial turn-key or consignment |
| Component Package | Cut Tape, Tube, Reels, Loose Parts |
| Turn Time | Same day service to 15 days service |
| Testing | Flying Probe Test; X-ray Inspection; AOI Test |
| PCBA Process | SMT → Wave Soldering → Assembling → ICT → Function Testing |
Our PCBA Capability
SMT, PTH, mixed technology
SMT: 2,000,000 solder joints per day
DIP: 300,000 joints per day
Ultra fine pitch, QFP, BGA, μBGA, CBGA
Advanced SMT assembly
Automated insertion of PTH (axial, radial, dip)
Cleanable, aqueous and lead-free processing
RF manufacturing expertise
Peripheral process capabilities
Press fit back planes & mid planes
Device programming
Automated conformal coating
SMT: 2,000,000 solder joints per day
DIP: 300,000 joints per day
Ultra fine pitch, QFP, BGA, μBGA, CBGA
Advanced SMT assembly
Automated insertion of PTH (axial, radial, dip)
Cleanable, aqueous and lead-free processing
RF manufacturing expertise
Peripheral process capabilities
Press fit back planes & mid planes
Device programming
Automated conformal coating
Testing Equipment
- Universal Tester
- Flying Probe Open/Short Tester
- High power Microscope
- Solder ability Testing Kit
- Peel Strength tester
- High Volt Open & Short tester
- Cross Section Molding Kit With Polisher
Quote Requirements for PCB and PCB Assembly
- Gerber file and Bom list Gerber file, PCB file, Eagle file or CAD file all acceptable
- Clear pictures of PCBA or PCBA sample for us (helps with fast purchasing)
- Test method for PCBA (guarantees 100% good quality products when delivered)
Assembly Capabilities
- Printed Circuit Board Assembly (PCBA)
- Through Hole
- Surface Mount (SMT)
- PCB Handling up to 400mm x 500mm
- RoHS Compliance Production
- Non RoHS Production - where permitted
- AOI
Component Technologies
- Passive Down to 0201 size
- BGA and VFBGA
- Leadless Chip Carriers/CSP
- Fine Pitch to 0.8mils
- BGA Repair and Reball
- Part Removal and Replacement
Your End-to-End PCB Assembly Solution for Demanding Circuit Boards
Today's innovations demand circuit boards that push the boundaries: dense multilayer designs, intricate HDI layouts, advanced RF components, and ultra-fine-pitch BGAs. If your project involves complex PCB assembly, partnering with a manufacturer equipped for the challenge isn't just beneficial - it's critical for success.
Why "Standard" Assembly Falls Short for Complex Boards
Complex PCBs introduce unique hurdles that generic assemblers often struggle with:
Microscopic Precision: Placing 01005 components or 0.3mm pitch BGAs requires advanced equipment and meticulous process control.
Advanced Materials: Handling high-frequency laminates (Rogers, Taconic) or heavy copper boards demands specialized expertise.
Intricate Layer Stacks: Managing 20+ layers, blind/buried vias, via-in-pad, and impedance control needs deep engineering collaboration.
Demanding Technologies: Integrating mixed-signal designs, embedded components, RF shielding, and strict thermal management requires proven capability.
Supply Chain Agility: Securing specialized, long-lead, or obsolete components for complex BOMs is a constant battle.
Microscopic Precision: Placing 01005 components or 0.3mm pitch BGAs requires advanced equipment and meticulous process control.
Advanced Materials: Handling high-frequency laminates (Rogers, Taconic) or heavy copper boards demands specialized expertise.
Intricate Layer Stacks: Managing 20+ layers, blind/buried vias, via-in-pad, and impedance control needs deep engineering collaboration.
Demanding Technologies: Integrating mixed-signal designs, embedded components, RF shielding, and strict thermal management requires proven capability.
Supply Chain Agility: Securing specialized, long-lead, or obsolete components for complex BOMs is a constant battle.
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