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Vurgulamak
BGA pcb board assembly manufacturing
,70UM pcb board assembly manufacturing
,BGA pcb assembly quote
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ürünBGA PCB Basılı Devre Kartları Montaj İşlemi
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üreticiÇin'de üretici
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İşlev testi% 100 fonksiyonel test
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HizmetimizPCB, anahtar teslim PCBA, PCB klonu, konut
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Anahtar kelimeMonte edilmiş baskılı devre kartları
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Cu thk1 oz
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Min Hat Aralığı0.1 mm
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Dış cu ağırlığı0.5-4 oz
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Place of OriginShenzhen,China
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Marka adıONESEINE
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SertifikaISO9001,ISO14001
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Model NumberONE-102
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Minimum Order Quantity1pcs
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FiyatUSD0.1-1000
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Packaging DetailsVacuun bag
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Delivery Time5-8 working days
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Payment TermsT/T,Western Union
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Supply Ability1000000000pcs/mon
BGA PCB Assembly Service 1.6mm FR4 70UM Copper
BGA PCB Board Assembly Manufacturing Quote 3mil 1.6mm 70UM Copper
Product Specifications
| Attribute | Value |
|---|---|
| Product | BGA PCB Printed Circuit Boards Assembly Process |
| Manufacturer | Manufacturer in China |
| Function Test | 100% Functional test |
| Our Service | PCB, Turnkey PCBA, PCB clone, housing |
| Keyword | Assembled Printed Circuit Boards |
| Cu Thk | 1OZ |
| Min Line Spacing | 0.1mm |
| Outer Cu Weight | 0.5-4OZ |
BGA PCB Basic Information
Material: Fr4 1.6mm
Layer: 6
Surface finish: Immersion gold
Copper weight: 70UM
Assembly components: IC chips (484 footprint)
Testing: X-Ray
Layer: 6
Surface finish: Immersion gold
Copper weight: 70UM
Assembly components: IC chips (484 footprint)
Testing: X-Ray
| Min line width | 3mil |
| Min line space | 3mil |
| Min hole | 0.2mm |
| Solder mask and silkscreen | Yes |
BGA PCB Technology Overview
BGA (Ball Grid Array) is a high-density surface mount packaging technology where spherical pins are arranged in a lattice pattern at the bottom of the package. This technology offers significant advantages over traditional packaging methods:
- High Density: Enables more interconnection pins than traditional packages, utilizing the entire bottom surface
- Improved Thermal Performance: Lower thermal resistance between package and PCB for better heat dissipation
- Enhanced Electrical Properties: Shorter leads reduce unwanted inductance for superior high-speed performance
- Space Efficiency: BGA packages are typically one-third the size of equivalent TSOP packages
BGA Assembly Considerations
BGA assembly requires precise control and specialized techniques:
- Automated soldering processes are typically required
- Not suitable for socket mounting
- Special attention needed for tin planting and separation techniques
- Temperature control is critical during assembly to prevent warping
BGA Development Challenges
During PCB development, BGA prototyping presents unique challenges:
- Specialized sockets required for development testing
- Spring pin sockets offer more reliable connections
- ZIF sockets may be unreliable, especially with small ball sizes
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