Electropolishing Low Volume SMT PCB Board Assembly Turnkey Custom
Product Specifications
Attribute |
Value |
Product Attributes |
Low-Volume PCB Assembly, SMT stencils, 2 layer pcb assembly, SMT |
PCBA Test |
X-ray, AOI Test, Functional test |
Solder Mask |
Orange, Green/Black/White/Red/Blue etc. |
Silkscreen Color |
White, Black, Yellow |
Testing Service |
Function Test, 100% Test |
Drill Deviation |
±0.05mm |
Component Sourcing |
Yes |
Standards |
IPC-A-610 E Class II-III |
Low-Volume Turnkey PCB Assembly with SMT Solder Paste Stencils
Our specialized SMT stencils serve as precise molds designed for accurate solder paste deposition onto PCBs, ensuring proper component placement and electrical connections.
SMT Stencil Types
- Laser Stencils: Most common type with precise aperture control
- Electro-polishing Templates: For enhanced surface finish
- Electroforming Templates: Ideal for fine pitch applications
- Step Stencils: Accommodates components with varying paste requirements
- Bonding Templates: For specialized applications
- Nickel-plated Templates: Increased durability and longevity
Standard Stencil Configurations
- Frameless SMT Stencils: For flexible printing solutions
- Framed SMT Stencils: Foils permanently mounted in aluminum frames
- Multi-level/Step Stencils: Solves co-planarity issues
- Electroformed Stencils: Superior paste release for fine pitch (20-12 mil)
Custom SMT Stencil Specifications
- Dimensions: 37×47cm to 40×140cm (customizable)
- Thickness: 0.08mm to 0.18mm (customizable)
- Minimum Aperture: 0.025mm
- Frame Material: Aluminum alloy
- Mesh Material: Stainless steel 204
- Adhesive: AB glue
- Standard Lead Time: 3-10 days after confirmation
- Sample Lead Time: 3 working days
- Shipping Options: Express, Air, or Sea
PCB Assembly Process Overview
- Component Procurement: Sourcing based on specifications and availability
- PCB Fabrication: Manufacturing bare boards with precise copper traces
- Component Placement: Automated SMD placement with pick-and-place machines
- Soldering: Reflow for SMD or wave soldering for through-hole components
- Inspection & Testing: AOI, X-ray, and functional verification
- Final Assembly: Integration of connectors, enclosures, and mechanical components
Advanced Assembly Technologies
- Surface Mount Technology (SMT): High-density component placement
- Through-Hole Technology (THT): For components requiring mechanical strength
- Mixed Technology: Combining SMT and THT for optimal design
- RoHS Compliance: Lead-free processes meeting environmental standards