FR4 1.6mm Epoxy FR4 Printed Circuit Board Material TG150 HDI PCB Board
Product Specifications
Attribute |
Value |
Product Description |
4Layer Fr4 tg130 PCB Circuit Board |
Number of Layers |
4 |
Material |
Fr4 |
TG Value |
130 |
Surface Finish |
Immersion gold |
Impedance Control |
100ohm +/-10% |
Copper Weight |
0.5--6oz |
Detailed PCB Parameters
- Number of layers: 4 layers
- Material: FR-4
- Finished product thickness: 1.55mm
- Finished copper foil thickness: 35UM
- Surface treatment: Immersion gold
- Minimum aperture: 0.2MM
- Minimum line width and distance: 0.144MM/0.082MM
FR4 PCB Applications
FR-4 is a common material for printed circuit boards (PCBs). A thin layer of copper foil is typically laminated to one or both sides of an FR-4 glass epoxy panel. These copper clad laminates are widely used in various electronic applications.
Thermal Stability Characteristics
FR4 PCBs demonstrate excellent thermal stability with these key properties:
- Glass Transition Temperature (Tg): 130-180°C range maintains mechanical properties at elevated temperatures
- Coefficient of Thermal Expansion (CTE): 12-18 ppm/°C minimizes stress during thermal cycling
- Thermal Conductivity: Adequate for most applications with optional thermal management solutions
- Process Compatibility: Withstands standard soldering and reflow processes
Material Advantages
FR4 PCBs offer an optimal combination of properties for demanding applications:
- Excellent dimensional stability across temperature ranges
- High mechanical strength and durability
- Resistance to moisture and chemicals
- Flame retardant properties for enhanced safety
- Low electrical conductivity between traces
These characteristics make FR4 PCBs ideal for consumer electronics, telecommunications, automotive systems, and industrial equipment applications.