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4Layer FR4 PCB Board 1.6mm TG130 Immersion Gold Finish

4Layer FR4 PCB Board 1.6mm TG130 Immersion Gold Finish

  • Vurgulamak

    Epoxy FR4 Printed Circuit Board

    ,

    Tg150 FR4 Printed Circuit Board

    ,

    TG150 hdi pcb board

  • Product description
    4Layer Fr4 tg130 PCB Circuit Board
  • Number of layers
    4
  • Material
    Fr4
  • TG value
    130
  • Surface finish
    Immersion gold
  • Impedance Control
    100ohm +/-10%
  • Copper Weight
    0.5--6oz
  • Produc Name
    FR4 tablet pcb board
  • Place of Origin
    Shenzhen,China
  • Marka adı
    ONESEINE
  • Sertifika
    ISO9001,ISO14001
  • Model Number
    ONE-102
  • Minimum Order Quantity
    1pcs
  • Fiyat
    USD0.1-1000
  • Packaging Details
    Vacuun bag
  • Delivery Time
    5-8 working days
  • Payment Terms
    T/T, Western Union
  • Supply Ability
    1000000000pcs/mon

4Layer FR4 PCB Board 1.6mm TG130 Immersion Gold Finish

FR4 1.6mm Epoxy FR4 Printed Circuit Board Material TG150 HDI PCB Board
Product Specifications
Attribute Value
Product Description 4Layer Fr4 tg130 PCB Circuit Board
Number of Layers 4
Material Fr4
TG Value 130
Surface Finish Immersion gold
Impedance Control 100ohm +/-10%
Copper Weight 0.5--6oz
Detailed PCB Parameters
  • Number of layers: 4 layers
  • Material: FR-4
  • Finished product thickness: 1.55mm
  • Finished copper foil thickness: 35UM
  • Surface treatment: Immersion gold
  • Minimum aperture: 0.2MM
  • Minimum line width and distance: 0.144MM/0.082MM
FR4 PCB Applications

FR-4 is a common material for printed circuit boards (PCBs). A thin layer of copper foil is typically laminated to one or both sides of an FR-4 glass epoxy panel. These copper clad laminates are widely used in various electronic applications.

Thermal Stability Characteristics

FR4 PCBs demonstrate excellent thermal stability with these key properties:

  • Glass Transition Temperature (Tg): 130-180°C range maintains mechanical properties at elevated temperatures
  • Coefficient of Thermal Expansion (CTE): 12-18 ppm/°C minimizes stress during thermal cycling
  • Thermal Conductivity: Adequate for most applications with optional thermal management solutions
  • Process Compatibility: Withstands standard soldering and reflow processes
Material Advantages

FR4 PCBs offer an optimal combination of properties for demanding applications:

  • Excellent dimensional stability across temperature ranges
  • High mechanical strength and durability
  • Resistance to moisture and chemicals
  • Flame retardant properties for enhanced safety
  • Low electrical conductivity between traces

These characteristics make FR4 PCBs ideal for consumer electronics, telecommunications, automotive systems, and industrial equipment applications.

4Layer FR4 PCB Board 1.6mm TG130 Immersion Gold Finish 0