Black Solder Mask ESP32 FR4 Double Sided PCB Board for UAV Drone
Product Specifications
Attribute |
Value |
Color |
Black |
Solder mask |
Yes |
Number of layers |
6 |
Material |
FR4 |
Product type |
Drone PCB |
Features |
Remote control, Diagram, Mini drone circuit board, Drone motor |
Board Thickness |
Single/Double: 0.008±0.004" |
Lead Time |
5-10 Working Days |
FR4 PCB Parameters
High precision prototype vs PCB bulk production specifications:
Parameter |
Prototype |
Bulk Production |
Max Layers |
1-28 layers |
1-14 layers |
MIN Line width (mil) |
3mil |
4mil |
MIN Line space (mil) |
3mil |
4mil |
Min via (mechanical drilling) |
Board thickness≤1.2mm: 0.15mm Board thickness≤2.5mm: 0.2mm Board thickness>2.5mm: Aspect Ration≤13:1 |
Board thickness≤1.2mm: 0.2mm Board thickness≤2.5mm: 0.3mm Board thickness>2.5mm: Aspect Ration≤13:1 |
Board thickness |
MAX: 8mm MIN: 2 layers:0.2mm; 4 layers:0.35mm; 6 layers:0.55mm; 8 layers:0.7mm; 10 layers:0.9mm |
MAX: 7mm MIN: 2 layers:0.2mm; 4 layers:0.4mm; 6 layers:0.6mm; 8 layers:0.8mm |
MAX Board size |
610*1200mm |
Max copper thickness |
0.5-6oz |
Why Choose Our UAV PCBs
- 11+ years experience manufacturing UAV PCBs with custom design files
- Professional flight electronic control circuit boards for FPV UAVs
- Fast PCB prototyping with production+delivery in as little as 6 days
- 24-hour quick sample service available
- No minimum quantity - single prototypes accepted
- One-time tooling charge for repeat orders
- Detailed quotations provided within 1 hour
- Cost-effective solutions to maximize customer benefits
FR4 Material Properties
Our standard FR-4 material features:
- High Glass Transition Temperature (Tg) (150Tg or 170Tg)
- High Decomposition Temperature (Td) (> 345º C)
- Low Coefficient of Thermal Expansion (CTE) (2.5%-3.8%)
- Dielectric Constant (@1 GHz): 4.25-4.55
- Dissipation Factor (@ 1 GHz): 0.016
- UL rated (94V-0, CTI = 3 minimum)
- Compatible with standard and lead-free assembly
Thermal Stability of FR4 PCBs
FR4 PCBs demonstrate excellent thermal stability with:
- Glass Transition Temperature (Tg) of 130-180°C
- Low Coefficient of Thermal Expansion (CTE) of 12-18 ppm/°C
- Compatibility with standard soldering and reflow processes
- Good dimensional stability across temperature ranges
- Flame retardant properties for enhanced safety
FR4 PCB Applications
FR-4 is widely used in:
- Printed circuit boards (PCBs) with copper clad laminates
- Relays, switches, and standoffs
- Busbars and washers
- Arc shields and transformers
- Screw terminal strips