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Vurgulamak
ro4350b FR4 Printed Circuit Board
,soldermask FR4 Printed Circuit Board
,ro4350b fr4 pcb board
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Product descriptionmultilayer pcb 1.6mm pcb 6 layer pcb BGA
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Attributespcb,fr4,soldermask,pcb china,ro4350b,print pcb,rogers,hdi board,ems pcb,tg170 pcb
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Solder MaskGreen oil and white character
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Min Line Space5mil
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Drill Deviation±(0.05mm)
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Min. Line Width/Spacing0.1mm
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Min. Annular Ring0.1mm
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File FormatsGerber Files;Pack-N-Place File(XYRS)
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Place of OriginShenzhen,China
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Marka adıONESEINE
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SertifikaISO9001,ISO14001
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Model NumberONE-102
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Minimum Order Quantity1pcs
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FiyatUSD0.1-1000
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Packaging DetailsVacuun bag
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Delivery Time5-8 working days
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Payment TermsT/T, Western Union
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Supply Ability1000000000pcs/mon
6 Layer FR4 PCB with HASL Lead Free Finish 1.6mm Thickness
Multilayer Ro4350b FR4 Printed Circuit Board PCB Soldermask Mass Production
Product Specifications
| Attribute | Value |
|---|---|
| Product Description | Multilayer PCB 1.6mm PCB 6 Layer PCB BGA |
| Solder Mask | Green oil and white character |
| Min Line Space | 5mil |
| Drill Deviation | ±(0.05mm) |
| Min. Line Width/Spacing | 0.1mm |
| Min. Annular Ring | 0.1mm |
| File Formats | Gerber Files; Pack-N-Place File(XYRS) |
Quick Details
- Layers: 6
- Material: FR4
- Surface Finish: HASL Lead free
- Copper Weight: 1OZ
- Board Size: 12*17CM
- Max Board Size: 60*110CM (without solder mask)
- Solder Mask Colors: Green, Blue, Red, Yellow, Purple, Black, White
- Delivery Time: Fast 24 hours, Normal 3-5 days
Standard FR-4 Material Properties
- High Glass Transition Temperature (Tg) (150Tg or 170Tg)
- High Decomposition Temperature (Td) (> 325º C)
- Low Coefficient of Thermal Expansion (CTE) (3.0%-3.8%)
- Dielectric Constant (@1 GHz): 4.25-4.55
- Dissipation Factor (@ 1 GHz): 0.016
- UL rated (94V-0, CTI = 4)
- Compatible with standard and lead-free assembly
- Laminate thickness available from 0.005" to 0.125"
Technical Specifications
| Layers | 1 to 24 layers |
| Material Type | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
| Board Thickness | 0.20mm to 3.4mm |
| Copper Thickness | 0.5 OZ to 6 OZ |
| Max. Board Size | 580mm×1200mm |
| Min. Drilled Hole Size | 4mil(0.1mm) |
| Surface Finishing | HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
| Certificates | UL, SGS, ISO 9001:2008 |
FR4 PCB Applications
FR-4 is the primary insulating backbone for most rigid printed circuit boards (PCBs). A thin layer of copper foil is laminated to one or both sides of an FR-4 glass epoxy panel to create copper-clad laminates. These are used in:
- Consumer electronics
- Telecommunications equipment
- Automotive systems
- Industrial equipment
- Relays and switches
- Transformers
- Busbars and terminal strips
FR4 PCB Classification
FR4 PCBs are available in various configurations to meet different application requirements:
- Single Sided PCBs: Components on one side, wiring on the other
- Double Sided PCBs: Panel wiring on both sides with vias for connections
- High Tg PCBs: For high operating temperature applications
- Halogen-free FR4: For environmental and safety requirements
- High Frequency FR4: For frequencies above 1GHz
- Impedance PCBs: For controlled impedance applications
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