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Vurgulamak
Full Turnkey FR4 Printed Circuit Board
,ODM FR4 Printed Circuit Board
,ODM metal pcb board
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Layers4
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Thickness2.6mm
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ApplicationIndustrial Control
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PCB TypeMultilayer Fr4
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SystemTurnkey PCB Board
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Copper Thinknes1 oz
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Min. Solder Mask Bridge0.08mm
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Slik Screen Colorwhite black blue green red
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Place of OriginShenzhen,China
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Marka adıONESEINE
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SertifikaISO9001,ISO14001
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Model NumberONE-102
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Minimum Order Quantity1pcs
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FiyatUSD0.1-1000
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Packaging DetailsVacuun bag
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Delivery Time5-8 working days
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Payment TermsT/T, Western Union
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Supply Ability1000000000pcs/mon
4-Layer FR4 PCB for Industrial Control 2.6mm Thickness
Industrial Control Metal FR4 Printed Circuit Board Full Turnkey PCB ODM
Product Specifications
| Attribute | Value |
|---|---|
| Layers | 4 |
| Thickness | 2.6mm |
| Application | Industrial Control |
| PCB Type | Multilayer Fr4 |
| System | Turnkey PCB Board |
| Copper Thickness | 1 oz |
| Min. Solder Mask Bridge | 0.08mm |
| Slik Screen Color | white black blue green red |
FR4 Material Thickness Industrial Control System Turnkey PCB Board
PCB Quick Details
- Layer: 4 layers
- Finished thickness: 2.6mm
- Min outer layer line width/distance: 0.1mm/0.11mm
- Min inner layer line width/distance: 0.12mm/0.15mm
- Min aperture: 0.25mm
- Minimum BGA solder joint: 0.23mm
- Impedance requirements: 50 ohm, Tolerance +/-10%
- Surface finished: Immersion Gold
Industrial Control PCB Solutions
Oneseine is a leading PCBA manufacturer specializing in time-critical, high performance Industrial Control PCB solutions. Our services include:
- High quality Industrial Control Board manufacturing
- Complete PCB & PCBA Service
- UL, SGS, Rohs Certificated products
- Competitive pricing with guaranteed quality
Industrial Control PCB Manufacturing Capabilities
| Total Pad Size | Standard | Advanced |
|---|---|---|
| Capture Pad | Drill + 0.008 | Drill + 0.006 |
| Landing Pad | Drill + 0.008 | Drill + 0.006 |
| BC Mechanical Drill (Type III) | 0.008 | 0.006 |
| Laser Drill Size | 0.004-0.010 | 0.0025 |
| Material Thickness | 0.0035 | 0.0025 |
| Stacked Via | Yes | Yes |
| Type I Capabilities single & Double Deep | Yes | Yes |
| Type II Capabilities Buried Vias with Microvias | Yes | Yes |
| Type III Capabilities | Yes | Yes |
| Copper Filled Microvia | Yes | Yes |
| Smallest Copper Filled Microvia | 0.004 | 0.0025 |
| Copper Filled Microvia Aspect Ratio | 0.75:1 | 1:1 |
| Smallest Laser Microvia Hole Size | 0.004 | 0.0025 |
| Laser Via Aspect Ratio (Depth:Diameter) | 0.75:1 | 1:1 |
FR4 Material Types
FR-4 has many variations with different thicknesses and chemical properties. Common designations include:
- Standard FR4: Most common type with good mechanical and moisture resistance (140-150℃ heat resistance)
- FR4 With High Tg: Suitable for applications requiring thermal cycling above 150℃
- FR4 With High CTI: Better thermal conductivity with comparative tracking index >600 Volts
- FR4 without copper laminate: Non-conductive material with excellent mechanical strength for insulating boards
- FR4 G10: Solid core material with high thermal shock resistance and excellent dielectric properties
High Frequency PCB Material Requirements
- Stable dielectric constant (Dk)
- Small dielectric loss (Df) for minimal signal loss
- Thermal expansion coefficient matching copper foil
- Low water absorption to maintain performance in damp conditions
- Excellent heat resistance, chemical resistance, impact strength, and peel strength
What Is FR4 PCB Material?
FR-4 is a high-strength, glass-reinforced epoxy laminate material used for printed circuit boards (PCBs). Defined by NEMA as a standard for glass-reinforced epoxy laminates, "FR" stands for flame retardant, with "4" differentiating it from similar materials. FR-4 PCB refers to boards manufactured with this woven glass-reinforced epoxy resin material, used in single-sided, double-sided, and multi-layered boards.
Standard FR-4 Material Properties
- High Glass Transition Temperature (Tg): 150Tg or 170Tg
- High Decomposition Temperature (Td): >345℃
- Low Coefficient of Thermal Expansion (CTE): 2.5%-3.8%
- Dielectric Constant (@1 GHz): 4.25-4.55
- Dissipation Factor (@1 GHz): 0.016
- UL rated (94V-0, CTI = 3 minimum)
- Compatible with standard and lead-free assembly
- Laminate thickness available from 0.005" to 0.125"
FR4 PCB Applications
FR-4 is the standard material for printed circuit boards (PCBs), with copper foil laminated to one or both sides of the glass epoxy panel (copper clad laminates). It's also used in:
- Relays and switches
- Standoffs and busbars
- Washers and arc shields
- Transformers and screw terminal strips
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