FR4 94V0 PCB Board Green HASL Lead Free Circuit Board

Fr4 Epoxy Laminate HASL LF PCB Green Fr4 Printed Circuit Board Maker is a high-quality circuit board solution manufactured with precision and reliability in mind.

• Name: FR4 PCB printed circuit board maker in China
• Layer: 4
• Material: Fr4
• Surface finish: HASL lead free
• Copper weight: 1OZ
• Thickness: 0.8mm
• Solder mask: Green
• Silkscreen: White
• Min line: 5mil
• Min hole: 0.3mm

• Inner packing: Anti-static bag (red or white bubble bag)
• Outer packing: Standard carton
• Protection: Polyfoam and multi-layer paperboard
• Custom packaging available upon request

Our FR4 4 layer multilayer printed circuit boards are manufactured according to UL/Rohs standards to ensure quality assemblies from start to finish. We maintain a sophisticated quality control system and protect your intellectual property with strict confidentiality agreements.

• 24-hour customer service
• Quick response: Quotations within 6 hours of receiving gerber files
• Gerber file design assistance
• PCB design services for customers without gerber files
• Tooling cost return and discounts for repeat orders over 3 square meters
• Printed circuit board gerber file design, Copy and Clone, OEM and ODM services
• Complete PCB Assembly services

• High Glass Transition Temperature (Tg): 150Tg or 170Tg
• High Decomposition Temperature (Td): > 345°C
• Low Coefficient of Thermal Expansion (CTE): 2.5%-3.8%
• Dielectric Constant (@1 GHz): 4.25-4.55
• Dissipation Factor (@ 1 GHz): 0.016
• UL rated (94V-0, CTI = 3 minimum)
• Compatible with standard and lead-free assembly
• Laminate thickness available from 0.005" to 0.125"

FR-4 is the standard material for printed circuit boards (PCBs), with copper foil laminated to one or both sides of the glass epoxy panel. These copper clad laminates are used in various applications including:

• Consumer electronics
• Telecommunications equipment
• Automotive electronics
• Industrial equipment
• Relays and switches
• Transformers and busbars

Our FR4 PCBs offer excellent thermal stability with the following characteristics:

• Glass Transition Temperature (Tg) of 130-180°C
• Low Coefficient of Thermal Expansion (CTE) of 12-18 ppm/°C
• Adequate heat dissipation for most electronic applications
• Compatibility with standard soldering and reflow processes
• Good dimensional stability across temperature ranges
• Flame retardant properties for enhanced safety