-
Vurgulamak
Copper FR4 Printed Circuit Board
,OSP FR4 Printed Circuit Board
,OSP fr 4 board
-
Layer6
-
Surface Finish TechnologyCUSTOMIZE
-
Assembly Optionyes
-
Min. Hole Size0.2mm
-
Cu Thk35UM
-
Min Line Width4 mil
-
OriginChina
-
Outer Copper Thickness5oz
-
Place of OriginShenzhen,China
-
Marka adıONESEINE
-
SertifikaISO9001,ISO14001
-
Model NumberONE-102
-
Minimum Order Quantity1pcs
-
FiyatUSD0.1-1000
-
Packaging DetailsVacuun bag
-
Delivery Time5-8 working days
-
Payment TermsT/T, Western Union
-
Supply Ability1000000000pcs/mon
6-Layer FR4 PCB with 5oz Copper and OSP Finish
5oz Copper Electronics FR4 Printed Circuit Board PCB Resin OSP Surface Finish
Product Specifications
| Attribute | Value |
|---|---|
| Layer | 6 |
| Surface Finish Technology | CUSTOMIZE |
| Assembly Option | yes |
| Min. Hole Size | 0.2mm |
| Cu Thk | 35UM |
| Min Line Width | 4 mil |
| Origin | China |
| Outer Copper Thickness | 5oz |
PCB Parameters
Material: FR-4
Layers: 6 layers (1+4+1)
Thickness: 1.0mm
Surface Finish: Immersion Gold + OSP
Copper thickness for outer layers: 1OZ
Min. trace width/space: 3mil/3mil
Min. drilling holes size: 0.2MM
Impedance control: Single ended to differential
Layers: 6 layers (1+4+1)
Thickness: 1.0mm
Surface Finish: Immersion Gold + OSP
Copper thickness for outer layers: 1OZ
Min. trace width/space: 3mil/3mil
Min. drilling holes size: 0.2MM
Impedance control: Single ended to differential
FR4 PCB Characteristics
FR4 PCBs offer excellent thermal stability, high mechanical strength, and resistance to moisture and chemicals. The material consists of copper foil laminated onto a woven fiberglass substrate impregnated with epoxy resin, providing:
- Good dimensional stability across temperature ranges
- Low electrical conductivity to prevent short circuits
- Flame retardant properties for fire safety
- Wide application in consumer electronics, telecommunications, automotive, and industrial equipment
FR4 Material Types
- Standard FR4: Most common type with heat resistance of 140-150℃
- High Tg FR4: Withstands temperatures above 150℃
- High CTI FR4: Improved thermal conductivity (CTI > 600V)
- Non-copper FR4: For insulating boards and supports
- FR4 G10: Solid core with excellent mechanical and dielectric properties
High Frequency PCB Material Requirements
- Stable dielectric constant (Dk)
- Low dielectric loss (Df) for minimal signal loss
- Thermal expansion coefficient matching copper foil
- Low water absorption
- Excellent heat and chemical resistance
FR4 PCB Applications
FR-4 is widely used for printed circuit boards with copper clad laminates. Additional applications include:
- Relays and switches
- Busbars and washers
- Arc shields and transformers
- Screw terminal strips
Thermal Stability Properties
FR4 PCBs maintain performance across temperature ranges with:
- Glass Transition Temperature (Tg) of 130-180°C
- Low Coefficient of Thermal Expansion (CTE) of 12-18 ppm/°C
- Compatibility with standard soldering and reflow processes
- Adequate heat dissipation for most electronic applications
İlgili Vakalar
Hizmetlerimiz tüm endüstrileri kapsar ve dünyanın her yerine ulaşır.