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Vurgulamak
F4B single sided printed circuit board
,ENIG single sided printed circuit board
,F4B copper core pcb
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ürün_adıYüksek frekanslı PCB
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malzemeF4b
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kökenÇin yapımı
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tipPCB devre kartları
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Place of OriginShenzhen,China
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Marka adıONESEINE
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SertifikaISO9001,ISO14001
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Model NumberONE-102
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Minimum Order Quantity1pcs
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FiyatUSD0.1-1000
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Packaging DetailsVacuun bag
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Delivery Time5-8 working days
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Payment TermsT/T,Western Union
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Supply Ability1000000000pcs/mon
F4B High Frequency PCB ENIG Finish Single Sided Circuit Board
| Attribute | Value |
|---|---|
| Product Name | High frequency PCB |
| Material | F4B |
| Origin | China-made |
| Type | PCB Circuit Boards |
- Material: F4B high frequency
- Layer: 2
- Surface finish: ENIG
- Board size: 7*8cm
- Copper weight: 1OZ
- Board thickness: 3.0MM
- Woven glass fabric copper-clad laminates (F4B-1/2)
- Woven glass fabric copper-clad laminates with high permittivity (F4BK-1/2)
- Woven glass fabric copper-clad laminates with high permittivity (F4BM-1/2)
- Woven glass fabric copper-clad laminates with high permittivity (F4BMX-1/2)
- Woven glass fabric copper-clad laminates with high permittivity (F4BME-1/2)
- Woven glass fabric copper-clad laminates with ceramic filled (F4BT-1/2) - New product
- Woven glass fabric planar resistor copper-clad laminates (F4BDZ294)
- Metal base woven glass fabric copper-clad laminates (F4B-1/AL,Cu)
- Copper-clad laminates (F4T-1/2)
- Microwave composite dielectric copper-clad substrate (TP-1/2)
- A special microwave composite dielectric copper-clad substrate (TPH-1/2) - New product
- Ceramic composite dielectric substrate (TF-1/2)
- Anti-sticking fabric (F4B-N)
- Insulation fabric (F4B-J)
- Ventilated fabric (F4B-T)
- Short delivery time
- More cost-effective than Rogers, Taconic, and Arlon materials
- Customizable thickness: 0.1-10mm
- Customizable DK: 2.2-10
High-frequency PCBs operate in frequency ranges from MHz to GHz and THz, ideal for wireless communication systems, radar, satellite communication, and high-speed data transmission.
These PCBs minimize signal loss and dispersion through low-loss dielectric materials, controlled impedance routing, and optimized via placement. The stackup configuration is carefully designed with multiple copper layers, dielectric materials, and ground planes to control impedance and minimize crosstalk.
Specialized RF connectors maintain consistent impedance while electromagnetic compatibility (EMC) standards are met through proper grounding, shielding, and filtering techniques.
Design involves simulation tools to assess signal integrity before fabrication, which requires advanced techniques due to specialized materials and tight tolerances. Rigorous testing ensures performance meets specifications through impedance testing, signal integrity analysis, and RF/microwave tests.
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