FR4 Rogers Stackup Multilayer HF PCB Board 10 طبقة ENIG التشطيب السطحي

قصيرة: اكتشف لوحة FR4 Rogers Stackup Multilayer HF PCB مع 10 طبقات و ENIG التشطيب السطحي، مصممة للتطبيقات عالية التردد مثل مكبرات الطاقة.هذا الـ (بي سي بي) المتقدم يجمع بين مواد (إف آر 4) و (روجرز) لتحقيق أداء متفوق، تقدم مواصفات ودراسات معينة.
خصائص المنتج ذات الصلة:
  • 10-layer multilayer PCB with FR4 and Rogers material stackup for high-frequency applications.
  • ENIG surface finishing ensures excellent solderability and corrosion resistance.
  • Board thickness ranges from 0.2mm to 7.0mm, accommodating various design needs.
  • Copper thickness options from 0.5OZ to 6OZ for enhanced conductivity.
  • Minimum hole size of 0.15mm and line width of 0.075mm for precision.
  • Available in multiple soldermask colors including green, yellow, black, blue, red, and white.
  • Certified with UL, ROHS, and ISO9001 for quality assurance.
  • Quick lead times with sample and batch production options based on layer count.
أسئلة وأجوبة:
  • What materials are used in the FR4 Rogers Stackup Multilayer HF PCB Board?
    The PCB combines FR4 and Rogers materials, offering a mix of dielectric properties suitable for high-frequency applications.
  • What is the lead time for a 10-layer PCB sample?
    The lead time for a 10-layer PCB sample is 8 workdays, with batch production taking 10 workdays.
  • What surface finishing options are available for this PCB?
    The PCB offers multiple surface finishing options including ENIG, HASL, and OSP, with ENIG being the default for superior performance.
  • What certifications does this PCB have?
    The PCB is certified with UL, ROHS, and ISO9001, ensuring high-quality standards and compliance.