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강조하다
6GHz RF Microwave PCB
,ENIG RF Microwave PCB
,1oz microwave circuit board
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임피던스 제어그래요
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로스 준수그래요
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최대 작동 주파수6GHz
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두께1.5 밀리미터
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최소 구멍 치수0.3 밀리미터
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최소 트레이스 폭00.1mm
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구리 두께1oZ
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표면 마감ENIG
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Place of OriginShenzhen,China
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브랜드 이름ONESEINE
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인증ISO9001,ISO14001
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Model NumberONE-102
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Minimum Order Quantity1pcs
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가격USD0.1-1000
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Packaging DetailsVacuun bag
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Delivery Time5-8 working days
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지불 조건전신환, 웨스턴 유니온
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Supply Ability1000000000pcs/mon
ENIG RF Microwave PCB 6GHz 1oz with Impedance Control
ENIG High Frequency RF Microwave PCB Circuit Board 6GHz 1oz
Product Specifications
| Impedance Control | Yes |
| Rohs Compliant | Yes |
| Maximum Operating Frequency | 6GHz |
| Thickness | 1.5mm |
| Minimum Hole Size | 0.3mm |
| Minimum Trace Width | 0.1mm |
| Copper Thickness | 1oz |
| Surface Finish | ENIG |
Product Overview
High Frequency RF Circuit Board Design - Top 8 Supplier
PCB quick details:
Material: Rogers 5880
PCB size: 190*80MM
Layer: 2
Surface finish: ENIG
Copper weight: 1OZ
RF PCB samples are provided
Material: Rogers 5880
PCB size: 190*80MM
Layer: 2
Surface finish: ENIG
Copper weight: 1OZ
RF PCB samples are provided
Microwave PCB Design Challenges
- Signal Integrity: Careful management of trace widths, controlled impedance, and transmission line structures to minimize signal degradation at high frequencies.
- Material Selection: Choosing substrate materials with low dielectric loss and consistent electrical properties for microwave frequencies.
- Miniaturization: Balancing compact designs with signal integrity and thermal management in densely packed components.
- Simulation Requirements: Using electromagnetic field solvers to analyze and optimize high-frequency PCB behavior.
- Thermal Management: Addressing heat dissipation through proper heat sinking and thermal via placement.
- EMI/EMC Considerations: Implementing effective grounding, shielding, and layout techniques to minimize interference.
- Manufacturing Precision: Meeting strict fabrication tolerances and material requirements for high-frequency performance.
Key Features of Microwave PCBs
- Optimized for high-frequency signals from 300MHz to several GHz
- Specialized materials like Rogers, Taconic, or Arlon substrates
- Precision controlled impedance traces and transmission lines
- RF connectors (SMA/SMP) for optimal high-frequency performance
- Advanced grounding and shielding techniques for noise reduction
- Applications in radar, satellite communications, and wireless networks
Note: Microwave PCB design and manufacturing requires specialized expertise in high-frequency applications. We recommend consulting with experienced PCB designers and manufacturers for optimal results.
관련 사례
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