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Làm nổi bật
COB led mcpcb board
,ODM led mcpcb board
,ODM blank mcpcb
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Sản phẩmCobersion Gold Aluminum PCB
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Thuộc tínhNhôm, lõi ngô, vàng ngâm, cực cao
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Hoàn thiện bề mặt PCBEnig
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Độ dày Cu2/0oz
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Huyền thoạiPSR-4000
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Màu bảngMặt nạ hàn xanh, màn hình lụa trắng
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Độ dày PCB0,2mm-4mm
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Độ dẫn nhiệt1.0-8.0 w/mk
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Place of OriginShenzhen,China
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Hàng hiệuONESEINE
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Chứng nhậnISO9001,ISO14001
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Model NumberONE-102
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Minimum Order Quantity1pcs
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Giá bánUSD0.1-1000
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Packaging DetailsVacuun bag
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Delivery Time5-8 working days
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Payment TermsT/T,Western Union
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Supply Ability1000000000pcs/mon
COB Immersion Gold Aluminum PCB Board 2OZ Copper 2mm Thickness
Immersion Gold Blank COB Led Mcpcb Board Aluminum Core ODM
Product Specifications
| Attribute | Value |
|---|---|
| Product | COB Immersion Gold Aluminum PCB Board |
| Attributes | Aluminum, COB, Immersion Gold, Ultra High |
| PCB Surface Finishing | ENIG |
| Cu Thickness | 2/0oz |
| Legend | PSR-4000 |
| Board Color | Green solder mask, white silk screen |
| PCB Thickness | 0.2mm-4mm |
| Thermal conductivity | 1.0-8.0 W/mK |
COB Immersion Gold Aluminum PCB Board For Ultra High Thermal Conductivity
PCB Parameters
- Material: High thermal conductivity aluminum PCB substrate
- Brand: Oneseine
- Thickness: 2mm
- Copper: 2OZ
- Certificate: ULE354470/ISO/SGS/IATF16949
- Soldermask: White
- Thermal conductivity coefficient: 2.0w/m.k
- Surface finish: Immersion gold
- E-Test: 100%
Next-Generation Metal Core PCB Technology
Pushing thermal and electrical boundaries with advanced material innovations and manufacturing processes.
Material Innovations
- Carbon-Nanotube Reinforced Aluminum boosts thermal conductivity to 350 W/mK
- Vapor-Chamber Embedded Cores achieve effective thermal conductivities >800 W/mK
- Anisotropic Graphite Foils provide in-plane σ=1700 W/mK
- Additive-Manufactured Microchannel Cores enable active liquid cooling
Advanced Manufacturing Processes
- AI-Driven Thermal Simulation with ±0.02mm tolerance
- Atomic Layer Deposition (ALD) with 50nm Al₂O₃ dielectric coatings
- Magnetic Field-Assisted Bonding boosts thermal conductivity 40%
- Thermal-Electrical Co-Design with fractal via arrays
Extreme Environment Validation
- Hypersonic Thermal Shock: -196°C to 650°C cycles
- Orbital Particle Radiation: 100kGy gamma exposure testing
- Multi-Physics Corrosion: Thermal cycling with 95% RH salt fog
- Electrodynamic Vibration: 100Grms random profiles
Product Image
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