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ONESEINE TECHNOLOGY CO.,LTD 86-757-86226896 sales@oneseine.com
Immersion Gold HDI PCB 2oz Copper Microvia Circuit Board

Immersion Gold HDI PCB 2oz Copper Microvia Circuit Board

  • Resaltar

    2oz hdi circuit board

    ,

    OEM hdi circuit board

    ,

    OEM 2oz copper pcb

  • Descripción del Producto
    Vendedor de placas de circuito de PCB HDI de China
  • Vendedor
    China del PWB
  • Tipo
    Placas de circuito de PCB HDI
  • aplicaciones
    Industria
  • Acabado de la superficie
    Oro de inmersión
  • Nombre de Produc
    Pcb prototipo para bga pcba
  • MICROVIAS
    1-2,10-16,12-16,14-16
  • El sistema
    Tipo neumático
  • Place of Origin
    Shenzhen,China
  • Nombre de la marca
    ONESEINE
  • Certificación
    ISO9001,ISO14001
  • Model Number
    ONE-102
  • Minimum Order Quantity
    1pcs
  • Precio
    USD0.1-1000
  • Packaging Details
    Vacuun bag
  • Delivery Time
    5-8 working days
  • Payment Terms
    T/T, Western Union
  • Supply Ability
    1000000000pcs/mon

Immersion Gold HDI PCB 2oz Copper Microvia Circuit Board

Immersion Gold Microvia HDI Circuit Board 2oz Copper PCB OEM
Product Specifications
Attribute Value
Product description HDI PCB Circuit Board Vendor From China
Vendor PCB China
Type HDI PCB Circuit Board
Applications Industry
Surface Finish Immersion gold
Product Name prototype pcb for bga pcba
Microvias 1-2,10-16,12-16,14-16
System pneumatic type
PCB Parameters
  • Number of layers: 2
  • Material: FR-4
  • Board thickness: 1.6mm
  • Surface treatment: Immersion gold
  • Minimum aperture: 0.1mm
  • Outer line width/line spacing: 4.5/4.5mil
  • Inner line width/line spacing: 4/3.5mil
  • Features: HDI circuit board
HDI PCB Design Guidelines
Ensuring Proper Stitching Vias or Ground Vias
  1. Determine Via Spacing and Distribution: Base spacing on signal frequency requirements and desired isolation level.
  2. Place Vias Along Signal Traces: Distribute evenly along traces for effective coupling with ground plane.
  3. Connect Vias to Solid Ground Plane: Ensure direct connection without interruptions for optimal return path.
  4. Use Sufficient Via Diameter and Aspect Ratio: Select appropriate size for conductivity and thermal dissipation.
  5. Avoid Via Stub Lengths: Minimize stubs to reduce impedance discontinuities and signal reflections.
  6. Consider Ground Via Arrays: Use multiple vias in grid patterns for enhanced isolation.
  7. Perform Signal Integrity Analysis: Conduct simulations to evaluate via effectiveness and adjust as needed.
Determining Transmission Line Characteristic Impedance
  • Empirical Formulas: Use microstrip transmission line formula for approximate calculations.
  • Field Solver Simulations: Employ specialized software (Ansys HFSS, CST Studio Suite) for precise impedance calculations in complex designs.
HDI PCB Applications
  • Mobile Devices: Smartphones, tablets with integrated processors and sensors
  • Computing and Networking: Servers, routers, data center equipment
  • Medical Devices: Diagnostic machines, imaging systems, implantable devices
  • Automotive Electronics: ADAS, infotainment systems, vehicle connectivity
  • Aerospace and Defense: Avionics, satellites, radar systems
  • Industrial and IoT: Automation systems, smart devices, environmental monitoring
Immersion Gold HDI PCB 2oz Copper Microvia Circuit Board 0