4 Layer Polyimide Flex PCB Board with ENIG Finish

4 Layer Flex Multilayer FPC Soft Pcb Polyimide Flexible Printed Circuit Board

• Application: Machinery and equipment
• Type: Four-layer FPC soft board
• Minimum drilling hole: 0.2mm
• Minimum line width/line spacing: 0.1mm/0.1mm
• Finished product thickness: 0.3+/-0.05mm
• Reinforcement: 0.4mm FR4 reinforcement on both sides
• Process requirements: Differential impedance is 90 ohms+/- 10% ohms
• Surface treatment: Gold deposit (120 mm thick nickel; 1 mm thick gold)
• Expedited sample: 24-48 hours/sample 1-3 days

Flexible Printed Circuit (FPC) is a highly reliable and excellent flexible printed circuit board made from polyimide or polyester film as the substrate. It features high wiring density, light weight, thin thickness, and excellent bending performance.

Also known as Flexible Circuit Board, FPC is favored for its characteristics of light weight, thin thickness, and free bending/folding capability. The technology was originally developed by the United States in the 1970s for space rocket applications.

Single-sided flexible circuits have a single conductor layer made of either metal or conductive polymer on a flexible dielectric film. Component termination features are accessible from one side only, with holes formed in the base film to allow component lead interconnection, typically by soldering.

Double-sided flex circuits feature two conductor layers, typically interconnected by plated through holes. This configuration allows component placement on either side and facilitates crossover connections. A common application is the circuit connecting a mousepad to a laptop motherboard.

Multilayer flex circuits contain three or more conductor layers, usually interconnected by plated through holes. Discontinuous lamination is often used in areas requiring maximum flexibility, leaving these sections unbonded for optimal bending performance.

Rigid-flex circuits combine rigid and flexible substrates laminated into a single structure. Unlike stiffened flex circuits, rigid-flex designs integrate both technologies at the substrate level. These multilayer structures are commonly used in applications like laptop display cables, capable of enduring tens of thousands of flexures.