logo
ONESEINE TECHNOLOGY CO.,LTD 86-757-86226896 sales@oneseine.com
10 Layer Impedance BGA ESP32 PCB Board for Industrial IoT

10 Layer Impedance BGA ESP32 PCB Board for Industrial IoT

  • Destacar

    Esp32 Multilayer PCB Board

    ,

    through hole Multilayer PCB Board

    ,

    custom pcb printing BGA

  • Número de camadas
    10
  • Controle da impedância
    Sim
  • BGA PCB
    Sim
  • Descrição do produto
    Impedância de 10 camadas BGA esp32 placa de PCB nua
  • Investigação
    Sim
  • Aplicativo
    Campo médico, telecomunicações
  • Cor da máscara de solda
    Verde, Vermelho, Azul, Preto, Branco, Amarelo, etc.
  • Anel de Min Annular
    5mil
  • Place of Origin
    Shenzhen,China
  • Marca
    ONESEINE
  • Certificação
    ISO9001,ISO14001
  • Model Number
    ONE-102
  • Minimum Order Quantity
    1pcs
  • Preço
    USD0.1-1000
  • Packaging Details
    Vacuun bag
  • Delivery Time
    5-8 working days
  • Termos de pagamento
    T/T, Western Union
  • Supply Ability
    1000000000pcs/mon

10 Layer Impedance BGA ESP32 PCB Board for Industrial IoT

Through Hole BGA ESP32 Multilayer PCB Board Custom Printing
Product Specifications
Attribute Value
Number of Layers 10
Impedance Control Yes
BGA PCB Yes
Application Medical Field, Telecommunications
Solder Mask Color Green, Red, Blue, Black, White, Yellow, etc.
Min Annular Ring 5mil
10-Layer Impedance BGA ESP32 Multi Layer PCB Design Bare Board
PCB Parameters
  • Material: ShengYi FR4 fiberglass board
  • Number of layers: 10-layer
  • Board thickness: 3.0mm
  • Copper thickness: 1oz
  • Surface treatment process: Immersion gold
  • Solder mask character color: green and white
  • Minimum line width/line spacing: 7.09/6.68mil
  • The smallest hole: 0.5mm
  • Technical features: with impedance
Precision 10-Layer ESP32 PCBs: China's Impedance-Controlled BGA Powerhouse for Industrial IoT Dominance

Engineered to overcome critical barriers in industrial IoT device development, our 10-layer impedance-controlled PCBs deliver superior performance for ESP32 applications.

Key Advantages
  • BGA Breakout Mastery: Supports 324-ball ESP32-S3/WROOM with 0.08mm microvias and via-in-pad plating
  • Mixed-Signal Isolation: Split ground planes and shielded cavities provide 40dB isolation for 2.4GHz antennas
  • Thermal Supremacy: Copper-filled vias reduce θJA by 60% and support 240MHz operation
  • Manufacturing Precision: LDI exposure with 25μm trace accuracy and 100% impedance validation
  • Reliability: Validated through 500 thermal cycles and 72hrs HAST testing
Certified Applications
  • Industry 4.0 Gateways: 32°C cooler than 6-layer designs
  • Medical Wearables: Passes IEC 60601-2-47 leakage tests
  • Robotics Control: Achieves 0.3μs interrupt latency
China's Competitive Edge
  • 7-Day Prototypes with impedance reports
  • 40% cost savings vs. U.S./EU fabs
  • Free ESP32 reference designs and signal integrity simulations
10 Layer Impedance BGA ESP32 PCB Board for Industrial IoT 0