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Flexible PCB Board 2 Layer Polyimide ENIG Finish High Flexibility

Flexible PCB Board 2 Layer Polyimide ENIG Finish High Flexibility

  • Podkreślić

    epoxy resin Flex PCB Board

    ,

    TG130 Flex PCB Board

    ,

    TG130 flexible printed circuit fpc

  • Max. Rozmiar panelu
    500 mm x 500 mm
  • Tworzywo
    Poliimid
  • Warstwa
    2
  • Min. Szerokość śledzenia
    0,1 mm
  • Liczba łopat
    Warstwa 2-4-6-8-10-12-16-20-22-28
  • Wykończenie powierzchni
    Enig
  • Warstwa Coun
    1-40
  • Elastyczność
    Wysoki
  • Test
    100% AOI, rentgen, latający test sondy.
  • Wyloty
    FR4 TG130
  • Temperatura robocza
    -40 ℃ do 125 ℃
  • Grubość tablicy
    0,4-4,0 mm
  • Min. Temperatura robocza
    -40 ° C.
  • Aplikacja
    Elektronika
  • Kolor maski lutowniczej
    Zielony
  • Place of Origin
    Shenzhen,China
  • Nazwa handlowa
    ONESEINE
  • Orzecznictwo
    ISO9001,ISO14001
  • Model Number
    ONE-102
  • Minimum Order Quantity
    1pcs
  • Cena
    USD0.1-1000
  • Packaging Details
    Vacuun bag
  • Delivery Time
    5-8 working days
  • Payment Terms
    T/T, Western Union
  • Supply Ability
    1000000000pcs/mon

Flexible PCB Board 2 Layer Polyimide ENIG Finish High Flexibility

Epoxy Resin Flexible PCB Board Printed Circuit FPC 28 Layer FR4 TG130
Product Specifications
Attribute Value
Max. Panel Size 500mm x 500mm
Material Polyimide
Layer 2
Min. Trace Width 0.1mm
Number Of Plies 2-4-6-8-10-12-16-20-22-28 Layer
Surface Finish ENIG
Layer Count 1-40
Flexibility High
Test 100% AOI, X-ray, Flying probe test
Material FR4 TG130
Operating Temperature -40℃ to 125℃
Board Thickness 0.4-4.0mm
Min. Operating Temperature -40°C
Application Electronics
Solder Mask Color Green
Customized Rigid Flex PCBs Fabricated with Expertise and Precision
PCB Quick Details
  • Number of layer: 4
  • Board thickness: Rigid part: 1.2mm, Flex part: 0.1mm
  • Brand: ONESEINE
  • Sample order: Acceptable
  • Application: Electronics products
  • Surface finish: Immersion gold
  • Item: rigid-flex PCB boards
Technical Challenges of Rigid-Flex PCB Technology

Rigid-flex PCBs present unique challenges compared to traditional rigid PCBs due to their complex design and manufacturing requirements:

  • Design Complexity: Requires careful component placement, routing across rigid and flexible sections, and management of mechanical stresses.
  • Manufacturing Challenges: Specialized equipment and processes needed for lamination, plating, and assembly of rigid-flex layers.
  • Testing and Reliability: Requires extensive flexibility, bending, and environmental testing to ensure long-term performance.
  • Design Constraints: Limitations on component placement, routing, and layer counts due to flexible material requirements.
  • Supply Chain Considerations: Limited number of specialized suppliers can result in longer lead times and higher costs.
Rigid-Flex PCB Components and Advantages

Rigid-flex PCBs combine rigid and flexible circuit board materials for compact, versatile solutions:

  • Rigid Layers: Standard FR-4 material providing structural support for components
  • Flexible Layers: Polyimide or polyester films allowing bending and conforming to shapes
  • Interconnections: Plated through-holes connecting rigid and flexible sections

Key Benefits: Space-saving design, improved reliability under flexing/vibration, enhanced functionality, and reduced assembly time.

Applications of Rigid-Flex PCB Technology

Rigid-flex PCBs are essential in modern electronics where space and reliability are critical:

  • Consumer Electronics: Smartphones, tablets, and wearable devices
  • Medical Devices: Endoscopes, catheters, and prosthetics requiring flexibility
  • Aerospace/Defense: Avionics and satellite systems with weight and reliability constraints
  • Automotive: Infotainment systems and driver assistance technologies
  • Industrial: Robotics and automation equipment with moving components