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Podkreślić
Polyimide Flex PCB Board
,prototype Flex PCB Board
,8 Layer polyimide flex pcb
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Jakość100% testu
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Min. min. Line Width/Spacing Szerokość linii/odstępy0,075 mm
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TworzywoFR-4, Poliimid, PET
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Minimalny rozmiar otworuOtwór mechaniczny: 0,15 mm
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min. Rozmiar dziury0,1 mm
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PrzedmiotPrototyp wielowarstwowych sztywnych/prężnych płyt PCB
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Liczba warstw8-warstwa
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Formaty plikówPliki Gerber;Pakiet Pack-N-Place ((XYRS)
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Place of OriginShenzhen,China
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Nazwa handlowaONESEINE
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OrzecznictwoISO9001,ISO14001
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Model NumberONE-102
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Minimum Order Quantity1pcs
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CenaUSD0.1-1000
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Packaging DetailsVacuun bag
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Delivery Time5-8 working days
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Payment TermsT/T, Western Union
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Supply Ability1000000000pcs/mon
8 Layer Polyimide Rigid Flex PCB Board FR-4 Material
Polyimide Rigid Flex PCB Board Prototype Production 8 Layer FR-4
Product Specifications
| Attribute | Value |
|---|---|
| Quality | 100% test |
| Min. Line Width/Spacing | 0.075mm |
| Material | FR-4, Polyimide, PET |
| Min Hole Size | Mechanical hole: 0.15mm |
| Min. Hole Size | 0.1mm |
| Item | Multilayer rigid/flex PCB prototype |
| Number Of Layers | 8-Layer |
| File Formats | Gerber Files; Pack-N-Place File (XYRS) |
Flexible PCB Production: Overcoming Challenges with Rigid Flex PCB
Product Introduction
Application field: High level medical equipment
Material: Shengyi A-grade material + FPC flexible board
Number of layers: 6
Plate thickness: 2.0 ± 0.05mm
Minimum aperture: 0.1mm
Minimum line width/line spacing: 0.076mm
Copper thickness: 1OZ each on the inner and outer layers
Solder resistance: blue oil and white letters
Material: Shengyi A-grade material + FPC flexible board
Number of layers: 6
Plate thickness: 2.0 ± 0.05mm
Minimum aperture: 0.1mm
Minimum line width/line spacing: 0.076mm
Copper thickness: 1OZ each on the inner and outer layers
Solder resistance: blue oil and white letters
Challenges in Flexible PCB Production
Producing Flexible Printed Circuits (FPCBs) involves several challenges that can impact quality, efficiency, and cost:
- Material Selection: Finding high-quality flexible materials and ensuring compatibility between different materials
- Design Complexity: Overcoming layout constraints and maintaining signal integrity in tight spaces
- Manufacturing Processes: Achieving high precision in etching and maintaining precise layer alignment during lamination
- Testing and Quality Assurance: Conducting rigorous reliability testing and overcoming inspection difficulties
- Cost Management: Controlling higher production costs and minimizing material waste
- Scalability: Maintaining quality when scaling up production and managing longer lead times
- Environmental Factors: Addressing temperature sensitivity and ensuring chemical resistance for durability
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