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ハイライト
5mil pcba oem
,FR4 pcba oem
,FR4 pcb fab and assembly
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PCBアウトライン正方形、円、不規則（ジグ付き）
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最小穴のサイズ0.2mm
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最大PCB寸法700*460mm
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サービスOEMメディカルPCBアセンブリ
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BGAサイズ0.25mm
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PCB生産を提供しますはい
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PCBAテストX線、AOIテスト、機能テスト
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テスト方法回路内テスト（ICT）
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制御インピーダンス+/- 5％
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はんだ付け時間10-30秒
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シルクスクリーン色白
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銅の厚さ0.5〜3.0オンス
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パネル1
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バイアス機能を差し込む0.2-0.8mm
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Place of OriginShenzhen,China
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ブランド名ONESEINE
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証明ISO9001,ISO14001
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Model NumberONE-102
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Minimum Order Quantity1pcs
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価格USD0.1-1000
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Packaging DetailsVacuun bag
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Delivery Time5-8 working days
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Payment TermsT/T, Western Union
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Supply Ability1000000000pcs/mon
5mil FR4 PCB Assembly OEM SMT DIP Control Circuit Boards
5mil FR4 DIP Circuit Board PCBA OEM Fabrication and Assembly with Components Sourcing
Product Specifications
| Attribute | Value |
|---|---|
| PCB Outline | Square, circle, irregular (with jigs) |
| Min Hole Size | 0.2mm |
| Max PCB Dimensions | 700 × 460mm |
| Services | OEM Medical PCB Assembly |
| BGA Size | 0.25mm |
| Provide PCB Production | Yes |
| PCBA Test | X-ray, AOI Test, Functional test |
| Testing Method | In-circuit testing (ICT) |
| Controlled Impedance | ±5% |
| Soldering Time | 10-30 seconds |
| Silkscreen Color | White |
| Copper Thickness | 0.5 to 3.0 oz |
| Panel | 1 |
| Plugging Vias Capability | 0.2-0.8mm |
OEM One Stop Electronic SMT/DIP PCBA Assembly Control Circuit Boards
General Specifications:
Layer: 2
Material: FR4
Board thickness: 1.0mm
Copper weight: 1OZ
Solder mask: Green
White silkscreen: White
Min line: 5mil
Min hole: 0.3mm
Application: Computer, communication field
Layer: 2
Material: FR4
Board thickness: 1.0mm
Copper weight: 1OZ
Solder mask: Green
White silkscreen: White
Min line: 5mil
Min hole: 0.3mm
Application: Computer, communication field
SMT/DIP PCBA Control Circuit Boards Manufacturing Capabilities
- Components Sourcing: Common components can be replaced with high-quality China brand components when permitted, reducing costs for clients. Genuine components can be ordered from designated suppliers or partner companies including Digikey, Mouser, Arrow, Avnet, Future Electronic, Farnell, etc.
- Assembly Types: SMT and Thru-hole
- Assembly Capacity:
- Stencil size/range: 736 × 736mm
- Minimum IC pitch: 0.30mm
- Maximum PCB size: 410 × 360mm
- Minimum PCB thickness: 0.35mm
- Minimum chip size: 0201 (0.2 × 0.1)/0603 (0.6 × 0.3mm)
- Maximum BGA size: 74 × 74mm
- BGA ball pitch: 1.00mm (minimum), 3.00mm (maximum)
- BGA ball diameter: 0.40mm (minimum), 1.00mm (maximum)
- QFP lead pitch: 0.38mm (minimum), 2.54mm (maximum)
- Frequency of stencil cleaning: 1 time/5 to 10 pieces
PCB Assembly (PCBA) Process
Step 1: Applying Solder Paste Using Stencil
Solder paste is applied to PCB areas where components will be placed using a stainless steel stencil. The paste (96.5% tin, 3% silver, 0.5% copper) creates strong joints when heated.
Step 2: Automated Placement of Components
Pick-and-place robots accurately position SMT components using preprogrammed X,Y coordinates from design files, ensuring precision and efficiency.
Step 3: Reflow Soldering
PCBs pass through an oven at 250°C to melt solder, creating permanent joints. Two-sided PCBs are processed one side at a time.
Step 4: Quality Control and Inspection
- Manual Inspection: Suitable for THT components and low-density boards
- Optical Inspection (AOI): High-speed automated inspection using multi-angle cameras
- X-ray Inspection: For complex PCBs to examine inner layer defects
Step 5: THT Component Fixation and Soldering
- Manual Soldering: Time-consuming but precise for through-hole components
- Wave Soldering: Automated process for single-sided PCBs with THT components
Step 6: Final Inspection and Functional Test
PCBs undergo electrical testing using oscilloscopes, DMMs, and function generators to verify all parameters meet design specifications.
Step 7: Final Cleaning, Finishing and Shipment
PCBs are cleaned with deionized water, dried with compressed air, and prepared for shipment.
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