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ハイライト
6oz fpga pcb design
,OSP fpga pcb design
,OSP hdi multilayer pcb
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製品名6層 医療機器 pcb X線 検査 PCB 印刷回路板
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製品説明pcbX線検査サービス 自動光学検査 pcbX線機械
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銅の厚さ0.5オンス - 6オンス
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ボードカット切断,Vスコア,タブルーティング,カウンター沈没
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穴の大きさ0.1mm
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表面OSP
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層の数6 層
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ファイル形式ゲルバーファイル,パック・N・プレイスファイル (XYRS)
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Place of OriginShenzhen,China
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ブランド名ONESEINE
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証明ISO9001,ISO14001
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Model NumberONE-102
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Minimum Order Quantity1pcs
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価格USD0.1-1000
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Packaging DetailsVacuun bag
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Delivery Time5-8 working days
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支払条件T/T、ウェスタンユニオン
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Supply Ability1000000000pcs/mon
6 Layer Medical X-Ray Inspection PCB with OSP Finish
6 Layer Medical Equipment X-Ray Inspection PCB
High-Quality FR4 PCB for Medical Applications
| Attribute | Specification |
|---|---|
| Product Name | 6 layer Medical Equipment PCB X-ray Inspection PCB |
| Copper Thickness | 0.5oz - 6oz |
| Board Cutting | Shear, V-Score, Tab-Routed, Counter Sunk |
| Min Hole Size | 0.1mm |
| Surface Finish | OSP |
| Number of Layers | 6 layers |
| File Formats | Gerber Files; Pack-N-Place File (XYRS) |
Product Specifications
Base Material: FR-4/HTG150-180 FR-4/CEM-1/CEM-3/Aluminum
Board Thickness: 1.6mm
Min. Line Width: 0.254mm
Min. Line Spacing: 3mil
Surface Finishing: HASL, Immersion Gold, OSP
Solder Mask: Double-sided Green LPI
Testing Service: X-Ray
Certificate: ISO 9001:2008/ISO
Board Thickness: 1.6mm
Min. Line Width: 0.254mm
Min. Line Spacing: 3mil
Surface Finishing: HASL, Immersion Gold, OSP
Solder Mask: Double-sided Green LPI
Testing Service: X-Ray
Certificate: ISO 9001:2008/ISO
Applications
- Medical equipment
- Communication industry
- Consumer electronics
- Automobile industry
Key Features
- Advanced R&D support and equipment for quality assurance
- Customer-focused approach to meet specific requirements
- High frequency telecom and high speed transmission capabilities
- Excellent thermal stress resistance (288°C, 10sec)
- Precise conductor width control (±0.02mm)
- Multiple thickness options available (0.5mm to 1.6mm)
FR4 Material Properties
Glass Transition Temperature (Tg): 150Tg or 170Tg
Decomposition Temperature (Td): > 345°C
Thermal Expansion (CTE): 2.5%-3.8%
Dielectric Constant (@1 GHz): 4.25-4.55
Dissipation Factor (@1 GHz): 0.016
UL Rating: 94V-0, CTI = 3 minimum
Decomposition Temperature (Td): > 345°C
Thermal Expansion (CTE): 2.5%-3.8%
Dielectric Constant (@1 GHz): 4.25-4.55
Dissipation Factor (@1 GHz): 0.016
UL Rating: 94V-0, CTI = 3 minimum
High Frequency PCB Requirements
- Stable dielectric constant (Dk)
- Low dielectric loss (Df) for minimal signal loss
- Matched thermal expansion coefficient with copper foil
- Low water absorption for consistent performance
- Excellent heat and chemical resistance
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