Industrial 4 Layer Heavy Copper PCB SMT Assembly For Aerospace
| Attribute |
Value |
| Product Type |
PCB |
| Layers |
4 |
| Material |
FR4 |
| Features |
Customized Mini Pad |
| Trade Term |
EX-WORK, DDO TO DOOR, FOC, FOB |
| Specialized In |
High-precision |
| Copper Thickness |
0.5OZ / 1 Oz / 2Oz or Custom |
| Application |
Telecommunications, Aerospace, Military |
4 Layer Customized Mini Pad Multi Layer Circuit Board PCB Maker
Basic Specifications
- Name: Multilayer printed circuit boards
- Layer: 4
- Material: FR4
- Thickness: 1.0mm
- Copper weight: 2OZ
- Surface finish: ENIG
- Board size: 15*8CM
- Panel: 2*1
- Solder mask: Green
- Silk screen: White
Multilayer PCB Manufacturing
Our highly trained PCB assembly technicians utilize state-of-the-art multilayer circuit board fabrication equipment to ensure that the finished boards meet your exacting standards and technical specifications. We offer same-day turn on two-layer PCBs and 24-hour turn on multilayer circuit boards without compromising quality.
Multi-layer Circuit Board Technology
Multi-layer circuit boards are fabricated by stacking two or more circuits with reliable pre-set interconnections. The production process involves creating each layer separately, then bonding them together through optical alignment and pressure. This technology allows for complex circuitry in compact designs, with layer counts ranging from 2 to over 30 in high-end applications.
Multilayer PCB Production Process
- Design: Schematic creation and layout using specialized PCB design software
- CAM Processing: Conversion of design data into manufacturing instructions
- Material Preparation: Cutting core material and copper foil to required specifications
- Inner Layer Processing: Cleaning, lamination, imaging, etching, and drilling
- Outer Layer Processing: Similar to inner layer with additional soldermask application
- Multilayer Lamination: Bonding layers under heat and pressure
- Plating and Surface Finish: Electroplating vias and applying protective coatings
- Routing and V-Cut: Separating individual PCBs from panels
- Assembly: Component placement and soldering
- Testing and Inspection: Quality verification through AOI and functional testing
Multilayer PCB Stack-up Configuration
Our multilayer PCBs feature optimized layer arrangements including signal layers, power/ground planes, prepreg insulation, and core material. The stack-up is carefully designed to ensure signal integrity, power distribution, thermal management, and manufacturability for your specific application requirements.
Industry Applications
Our 4-layer heavy copper PCBs are ideal for demanding applications in:
- Aerospace and defense systems
- Telecommunications infrastructure
- Military electronics
- High-reliability industrial equipment
- Medical devices
- Power electronics