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ハイライト
RO4350B Dual Sided PCB
,CEM-3 Dual Sided PCB
,RO4350B high frequency circuit board
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機械的剛性剛性
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マルテリアルロジャース
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層2-48レイヤー
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銅の厚さ0.5Oz-6oz
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材料FR-4、CEM-1/3、HF材料、テフロン、ロジャース
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はんだマスク緑
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Place of OriginShenzhen,China
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ブランド名ONESEINE
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証明ISO9001,ISO14001
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Model NumberONE-102
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Minimum Order Quantity1pcs
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価格USD0.1-1000
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Packaging DetailsVacuun bag
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Delivery Time5-8 working days
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支払条件T/T、ウェスタンユニオン
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Supply Ability1000000000pcs/mon
RO4350B Dual Sided PCB High Frequency Circuit Board CEM-1 CEM-3 Material
Dual Sided RO4350B High Frequency PCB With Dielectric Constants Ranging From 2.2 To 10.6
Product Specifications
| Attribute | Value |
|---|---|
| Mechanical Rigid | Rigid |
| Material | Rogers |
| Layer | 2-48 layers |
| Copper Thickness | 0.5oz-6oz |
| Materials |
FR-4 CEM-1/3 HF material Teflon Rogers
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| Solder Mask | Green |
Detailed Parameters
- Material: RO4350B
- Number of layers: 4
- Plate thickness: 0.254mm
- Minimum aperture: Mechanical hole 0.2mm
- Minimum line width/line spacing: 0.35mm
- Copper thickness: 1OZ each on the inner and outer layers
- Solder resistance: green oil with white letters
- Surface technology: sinking gold
Top-tier high-frequency material resources ensure your products have a competitive advantage. We offer both imported and domestic boards with dielectric constants ranging from 2.2 to 10.6.
Available High Frequency Materials
Rogers/Rogers Taconic/Taikonli Arlon Isola F4BM/Wangling PTFE/PTFE TP-2
Rogers Series Materials
RO4350B RO4003C RT5880 RT5870 RO3003 RO3010 RO4730 RT6006 RT6010
High Frequency PCB Overview
High-frequency PCBs are specifically engineered to handle radio frequency (RF) and microwave signals while minimizing signal loss and maintaining integrity. These boards are essential for applications requiring precise signal transmission at high frequencies.
Key Features of High-Frequency PCBs
- Specialized Materials: Utilize low dielectric constant (Dk) and low dissipation factor (Df) materials like PTFE, enhanced FR-4, Rogers, or Taconic laminates
- Controlled Impedance: Precise trace geometries maintain consistent impedance for signal integrity
- Optimized Signal Paths: Careful component placement minimizes parasitic effects and signal path lengths
- Advanced Transmission Lines: Incorporates microstrip or stripline designs for high-frequency signal transmission
- Enhanced Via Design: Techniques like back drilling reduce signal reflections between layers
- Effective Shielding: Copper pours and ground planes minimize EMI and RF leakage
Industry Applications
- Wireless communication systems
- Aerospace and defense technologies
- Radar and satellite systems
- Medical imaging devices
- High-speed data transmission equipment
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