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DK2.2 Arlon 880 HF PCB 1.524mm 1GHz-100GHz ENIG

DK2.2 Arlon 880 HF PCB 1.524mm 1GHz-100GHz ENIG

  • ハイライト

    DK2.2 HF PCB

    ,

    1GHz HF PCB

    ,

    1.524mm arlon pcb

  • 製品説明
    DK2.2 アルロン880HF PCB 印刷回路板 製造
  • 材料
    ロジャース/PTFE
  • PCB タイプ
    HF PCB
  • DK値
    2.2
  • 周波数範囲
    1GHzから100GHz
  • 番号の層
    2
  • 表面 完成
    浸水金
  • Place of Origin
    Shenzhen,China
  • ブランド名
    ONESEINE
  • 証明
    ISO9001,ISO14001
  • Model Number
    ONE-102
  • Minimum Order Quantity
    1pcs
  • 価格
    USD0.1-1000
  • Packaging Details
    Vacuun bag
  • Delivery Time
    5-8 working days
  • 支払条件
    T/T、ウェスタンユニオン
  • Supply Ability
    1000000000pcs/mon

DK2.2 Arlon 880 HF PCB 1.524mm 1GHz-100GHz ENIG

DK2.2 Arlon 880 HF PCB Printed Circuit Board (1GHz-100GHz)
Product Specifications
Attribute Value
Material Rogers/PTFE
PCB Type HF PCB
DK Value 2.2
Frequency Range 1GHz-100GHz
Layer Count 2
Surface Finish Immersion Gold (ENIG)
Product Details
HF HIGH FREQUENCY PCB board with dielectric constant of 2.2 (alternative materials: TLY-5, RT5880, NY9220). Manufactured using Arlon 880 1.524mm material with ENIG surface finish.
Key Parameters: 2-layer construction, 1OZ copper weight, finished board thickness of 1.6mm. Standard board size of 12×15cm, available in quantities of 15 pieces with a 7-day delivery time for prototypes.
HF PCB Applications
  • Military Radar Feed Networks
  • Commercial Phased Array Networks
  • Low Loss Base Station Antennas
  • Missile Guidance Systems
  • Digital Radio Antennas
  • Filters, Couplers, and LNAs
HF Material Selection Guide
Brand Model Thickness (mm) DK(ER)
Rogers RO4003 0.203, 0.5, 0.813, 1.524 3.38
Rogers RO4350 0.168, 0.254, 0.508, 0.762, 1.524 3.5
Rogers RO4360G2 0.61, 1.524 6.15
Rogers RT5880 0.254, 0.508, 0.787 2.2
TACONIC TLY-5 0.254, 0.508, 0.8 2.2
ARLON Diclad880 0.762, 1.524mm 2.2
Key Characteristics of HF PCB Substrate Materials
  • Small and stable dielectric constant (Dk) - critical for signal transmission rate
  • Minimal dielectric loss (Df) - ensures high signal quality with low loss
  • Thermal expansion coefficient matching copper foil - prevents separation during temperature changes
  • Low water absorption - maintains stable dielectric properties in humid conditions
  • Excellent heat resistance, chemical resistance, impact strength, and peel strength