-
Menyoroti
COB led mcpcb board
,ODM led mcpcb board
,ODM blank mcpcb
-
ProdukPapan PCB aluminium emas perendaman COB
-
AtributAluminium, tongkol, emas imersi, ultra tinggi
-
Finishing permukaan PCBEnig
-
Ketebalan cu2/0oz
-
LegendaPSR-4000
-
Warna papanTopeng solder hijau, layar sutra putih
-
Ketebalan PCB0.2mm-4mm
-
Konduktivitas termal1.0-8.0 w/mk
-
Place of OriginShenzhen,China
-
Nama merekONESEINE
-
SertifikasiISO9001,ISO14001
-
Model NumberONE-102
-
Minimum Order Quantity1pcs
-
HargaUSD0.1-1000
-
Packaging DetailsVacuun bag
-
Delivery Time5-8 working days
-
Payment TermsT/T,Western Union
-
Supply Ability1000000000pcs/mon
COB Immersion Gold Aluminum PCB Board 2OZ Copper 2mm Thickness
Immersion Gold Blank COB Led Mcpcb Board Aluminum Core ODM
Product Specifications
| Attribute | Value |
|---|---|
| Product | COB Immersion Gold Aluminum PCB Board |
| Attributes | Aluminum, COB, Immersion Gold, Ultra High |
| PCB Surface Finishing | ENIG |
| Cu Thickness | 2/0oz |
| Legend | PSR-4000 |
| Board Color | Green solder mask, white silk screen |
| PCB Thickness | 0.2mm-4mm |
| Thermal conductivity | 1.0-8.0 W/mK |
COB Immersion Gold Aluminum PCB Board For Ultra High Thermal Conductivity
PCB Parameters
- Material: High thermal conductivity aluminum PCB substrate
- Brand: Oneseine
- Thickness: 2mm
- Copper: 2OZ
- Certificate: ULE354470/ISO/SGS/IATF16949
- Soldermask: White
- Thermal conductivity coefficient: 2.0w/m.k
- Surface finish: Immersion gold
- E-Test: 100%
Next-Generation Metal Core PCB Technology
Pushing thermal and electrical boundaries with advanced material innovations and manufacturing processes.
Material Innovations
- Carbon-Nanotube Reinforced Aluminum boosts thermal conductivity to 350 W/mK
- Vapor-Chamber Embedded Cores achieve effective thermal conductivities >800 W/mK
- Anisotropic Graphite Foils provide in-plane σ=1700 W/mK
- Additive-Manufactured Microchannel Cores enable active liquid cooling
Advanced Manufacturing Processes
- AI-Driven Thermal Simulation with ±0.02mm tolerance
- Atomic Layer Deposition (ALD) with 50nm Al₂O₃ dielectric coatings
- Magnetic Field-Assisted Bonding boosts thermal conductivity 40%
- Thermal-Electrical Co-Design with fractal via arrays
Extreme Environment Validation
- Hypersonic Thermal Shock: -196°C to 650°C cycles
- Orbital Particle Radiation: 100kGy gamma exposure testing
- Multi-Physics Corrosion: Thermal cycling with 95% RH salt fog
- Electrodynamic Vibration: 100Grms random profiles
Product Image
Kasus Terkait
Layanan kami mencakup semua industri dan menjangkau seluruh belahan dunia.