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ONESEINE TECHNOLOGY CO.,LTD 86-757-86226896 sales@oneseine.com
Fast PCB Assembly Service with SMT and THD Mixed Technology

Fast PCB Assembly Service with SMT and THD Mixed Technology

  • प्रमुखता देना

    odm electronics pcb manufacturing

    ,

    Pcbway electronics pcb manufacturing

    ,

    odm prototype pcb assembly

  • product_attributes
    पीसीबी असेंबली, एफआर 4 पीसीबी, घटक सोर्सिंग, इलेक्ट्रॉनिक पीसीबी असेंबली
  • संबंधित_कीवर्ड
    पीसीबी असेंबली अर्थ, पीसीबी असेंबली यूएसए, पीसीबी असेंबली सर्विसेज एनएआरएस एमई, पीसीबी असेंबली एमई क
  • सेवा
    पीसीबी और पीसीबीए
  • मिलान प्रकार
    लीड -फ्री - आरओएचएस
  • पैकेट
    QFN, BGA, SSOP, PLCC, LGA
  • मानकों
    IPC-A-610 E CLASS II-III
  • नकाब
    पीला+हरा
  • छेद उत्पाद के माध्यम से
    2 डुबकी लाइनें
  • Place of Origin
    Shenzhen,China
  • ब्रांड नाम
    ONESEINE
  • प्रमाणन
    ISO9001,ISO14001
  • Model Number
    ONE-102
  • Minimum Order Quantity
    1pcs
  • मूल्य
    USD0.1-1000
  • Packaging Details
    Vacuun bag
  • Delivery Time
    5-8 working days
  • Payment Terms
    T/T,Western Union
  • Supply Ability
    1000000000pcs/mon

Fast PCB Assembly Service with SMT and THD Mixed Technology

Fast PCBWay Electronic Products Prototype SMT DIP PCB Assembly
Product Specifications
Service PCB & PCBA
Solder Type Lead-free - RoHS
Package QFN, BGA, SSOP, PLCC, LGA
Standards IPC-A-610 E Class II-III
Mask Yellow + Green
Through Hole Product 2 DIP Lines
General Information
  • Base material: FR4
  • Layer: 2
  • Name: Amplifier PCB assembly
  • Surface finish: HASL lead free
  • Copper thickness: 1OZ
  • Testing: Flying probe test, X-ray Inspection, AOI (Automated Optical Inspection), ICT (In-Circuit Test)/Functional Testing
PCB Assembly Manufacturing Capabilities
Type of Assembly THD (Thru-Hole Device), SMT (Surface-Mount Technology), SMT & THD mixed, Double-sided SMT and THD assembly
Solder Type Water Soluble Solder Paste, Leaded process and Lead-Free (RoHS)
Components Passives parts (smallest size 0201), BGA, uBGA, QFN, POP, Leadless chips, Fine Pitch to 0.8Mils, Connectors and terminals
Bare Board Size Smallest: 0.25"x 0.25" (6.35mm x 6.35mm), Largest: 20" x 20" (508mm x 508mm)
Min. IC Pitch 0.012" (0.3mm)
QFN Lead Pitch 0.012" (0.3mm)
Max. BGA size 2.90" x 2.90" (74mm x 74mm)
Type of Service Turn-key, partial turn-key or consignment
Testing X-ray Inspection, AOI (Automated Optical Inspection), ICT (In-Circuit Test)/Functional Testing
Component packaging Reels, cut tape, Tube and tray, Loose parts and bulk
PCB Assembly Concept

PCBA (Printed Circuit Board Assembly) refers to the process of assembling components onto a PCB bare board through SMT and DIP plug-in processes. A printed circuit board mechanically supports and electrically connects electronic components using conductive tracks, pads and other features etched from copper sheets laminated onto a non-conductive substrate.

PCBs can be single sided (one copper layer), double sided (two copper layers) or multi-layer (outer and inner layers). FR-4 glass epoxy is the primary insulating substrate. PCBs are used in nearly all electronic products, offering cost-effective and automated manufacturing compared to alternative wiring methods.

PCB/PCBA Order Tips
  • PCB order: Please provide Gerber File and manufacturing specifications
  • PCBA order: Please provide Gerber File, Manufacturing specification, BOM list and Pick & Place/XY file
  • Reverse engineering and PCB copy service available with your PCB sample
  • PCB design requires detailed function information or supply drawing
Main PCBA Equipment
Item Device Name Model Brand Qty Remarks
1 Full Automatic Screen Printer DSP-1008 DESEN 8
2 SMT Machine YG200 YAMAHA 5 8 SMT Line
3 SMT Machine YV100XG YAMAHA 3
4 SMT Machine YG100XGP YAMAHA 19
5 SMT Machine YV88 YAMAHA 5
6 Reflow Soldering 8820SM NOUSSTAR 4
7 Reflow Soldering XPM820 Vitronics Soltec 3
8 Reflow Soldering NS-800 II JT 1
9 Solder Paste Inspection REAL-Z5000 REAL 1
10 Automatic Optical Inspection System B486 VCTA 3
Fast PCB Assembly Service with SMT and THD Mixed Technology 0 Fast PCB Assembly Service with SMT and THD Mixed Technology 1
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