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Επισημαίνω
Custom hdi printed circuit board
,Interconnect hdi printed circuit board
,4 Layer interconnect pcb
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product_attributes (προϊόντα)fr4,4Υπηρεσία σχεδιασμού πρωτοτύπων κυκλωμάτων, συστοιχία, ανδρείκελα.
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Κου Τάκ1ΟZ
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ΠροέλευσηΚίνα
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Μίν. Γέφυρα με μεταξοειδή οθόνη0.1 mm
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Επεξεργασία επιφάνειαςΧρυσός βύθισης
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Θερμική Αγωγιμότητα00,3 W/mK - 3,0 W/mK
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Μάσκα συγκόλλησηςΠράσινο λάδι και λευκό χαρακτήρα
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Δυνατότητα ανοχής σε πάχος± 8%
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Place of OriginShenzhen,China
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ΜάρκαONESEINE
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ΠιστοποίησηISO9001,ISO14001
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Model NumberONE-102
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Minimum Order Quantity1pcs
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ΤιμήUSD0.1-1000
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Packaging DetailsVacuun bag
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Delivery Time5-8 working days
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Όροι πληρωμήςT/T, Western Union
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Supply Ability1000000000pcs/mon
4 Layer FR4 HDI PCB with Immersion Gold Surface
Custom FR4 HDI Printed Circuit Board Interconnect PCB Assembly 4 Layer
Product Specifications
| Attribute | Value |
|---|---|
| Cu Thickness | 1OZ |
| Origin | China |
| Min. Silkscreen Bridge | 0.1mm |
| Surface Treatment | Immersion gold |
| Thermal Conductivity | 0.3W/mK - 3.0W/mK |
| Solder Mask | Green oil and white character |
| Thickness Tolerance | ±8% |
FR4 Standard 4 Layer HDI PCB Board Details
- Number of layers: 4
- Material: FR-4
- Board thickness: 1.6mm
- Surface treatment: Immersion gold
- Minimum aperture: 0.1mm
- Outer line width/line spacing: 5/5mil
- Inner line width/line spacing: 4/4mil
- Features: HDI circuit board
Thermal Stability Characteristics
FR4 PCBs demonstrate excellent thermal stability, maintaining performance across a wide temperature range without warping, delamination, or failure.
Key Thermal Properties: Glass Transition Temperature (Tg) of 130-180°C, Coefficient of Thermal Expansion (CTE) of 12-18 ppm/°C, and thermal conductivity suitable for most electronic applications.
These boards withstand standard soldering and reflow processes while maintaining dimensional stability. Additional thermal management features like thermal vias can be incorporated for enhanced performance.
Material Advantages
FR4 PCBs combine woven fiberglass and epoxy resin for superior mechanical strength, moisture resistance, and flame retardancy. The copper-clad substrate provides reliable electrical connections with excellent dimensional stability.
Ideal for demanding applications in consumer electronics, telecommunications, automotive systems, and industrial equipment where reliability and safety are critical.
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