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6 Layer FR4 Multilayer PCB Board 1.6mm with Blind Buried Vias

6 Layer FR4 Multilayer PCB Board 1.6mm with Blind Buried Vias

Προϊόντα - Πίνακας πολυεπίπεδων PCB
  • Επισημαίνω

    Immersion gold pcb rf

    ,

    1.6mm pcb rf

    ,

    FR4 rigid pcb board

  • Υλικό
    FR4
  • Πάχος
    1.6 χιλ.
  • Αριθμός στρωμάτων
    6
  • Ειδικά χαρακτηριστικά
    Κωφλοί σωλήνες, θαμμένοι σωλήνες.
  • Αριθμός στρώματος
    1-60
  • Ελάχιστο πλάτος/διαχωρισμός
    3 εκατοστά/3 εκατοστά
  • ανώτατο μέγεθος PCB
    1500*800mm
  • Χρώμα Soldermask
    Λευκό μαύρο κόκκινο μπλε κίτρινο μωβ κλπ.
  • Place of Origin
    Shenzhen,China
  • Μάρκα
    ONESEINE
  • Πιστοποίηση
    ISO9001,ISO14001
  • Model Number
    ONE-102
  • Minimum Order Quantity
    1pcs
  • Τιμή
    USD0.1-1000
  • Packaging Details
    Vacuun bag
  • Delivery Time
    5-8 working days
  • Payment Terms
    T/T, Western Union
  • Supply Ability
    1000000000pcs/mon

6 Layer FR4 Multilayer PCB Board 1.6mm with Blind Buried Vias

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Immersion Gold FR4 Multilayer Rigid PCB RF Board 1.6mm 3mil
Product Specifications
Attribute Value
Material FR4
Thickness 1.6mm
Layer Count 6
Special Features Blind vias, Buried vias
Layer Number 1-60
Min. Trace Width/Spacing 3mil/3mil
Max PCB Size 1500*800mm
Soldermask Color White, Black, Red, Blue, Yellow, Purple etc.
PCB Parameters
  • Number of layers: 6
  • Material: FR-4
  • Board thickness: 1.6mm
  • Board used: FR4
  • Surface treatment: Immersion gold
  • Minimum aperture: 0.1mm
  • Outer line width/line spacing: 4/4mil
  • Inner line width/line spacing: 3.5/4.5mil
  • Solder mask character color: green and white
Multilayer PCB Types
Several types of multilayer PCBs serve different applications:
  • Standard Multilayer PCB: Basic 4-8 layer boards for general electronics
  • HDI PCB: High-density with microvias for compact devices
  • Flex/Rigid-Flex PCB: Combines flexible and rigid sections for specialized applications
  • Sequential Lamination PCB: For complex designs requiring 10+ layers
  • Metal Core PCB: Aluminum/copper core for superior heat dissipation
  • RF/Microwave PCB: Specialized materials for high-frequency applications
Applications
Multilayer PCBs are essential in industries requiring complex circuitry:
  • Consumer electronics (smartphones, tablets, TVs)
  • Telecommunications infrastructure
  • Automotive control systems
  • Industrial automation and robotics
  • Aerospace and defense systems
  • Medical diagnostic equipment
  • Power electronics and energy systems
Production Process Overview
  1. Design and CAM processing
  2. Material preparation and inner layer processing
  3. Outer layer processing and multilayer lamination
  4. Plating, surface finish application
  5. Routing and V-cut separation
  6. Component assembly and soldering
  7. Testing, inspection, and packaging
PCB Stack-Up Configuration
The layer arrangement determines electrical performance and reliability:
  • Signal layers for electrical routing
  • Power and ground planes for stable reference
  • Prepreg insulating layers
  • Core layer for mechanical stability
  • Surface layers for external connections
  • Soldermask and silkscreen protective layers
6 Layer FR4 Multilayer PCB Board 1.6mm with Blind Buried Vias 0
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