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Hervorheben
Automotive HF PCB
,5mil HF PCB
,5mil immersion gold pcb
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ErzeugnisElektronische Leiterplatten für Fahrzeuge
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Schichten4 Schichten
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TypeLeiterplatte
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AnwendungAutomobilsignalübernahme
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TestE-Prüfung 100%
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Aspect Ratio8:1
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SeidenfarbeWeiß, Schwarz, Gelb
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Min. Linienbreite5mil
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Place of OriginShenzhen,China
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MarkennameONESEINE
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ZertifizierungISO9001,ISO14001
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Model NumberONE-102
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Minimum Order Quantity1pcs
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PreisUSD0.1-1000
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Packaging DetailsVacuun bag
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Delivery Time5-8 working days
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ZahlungsbedingungenT/T, Western Union
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Supply Ability1000000000pcs/mon
4 Layer Automotive HF PCB Board 5mil Line Immersion Gold
Automotive Electronics 5mil HF PCB Circuit Board Immersion Gold 4 layer
Product Specifications
| Attribute | Value |
|---|---|
| Product | Automotive PCB electronics PCB |
| Layers | 4 layer |
| Type | Circuit Board |
| Application | Automotive Signal Acquisition |
| Testing | 100% E-Testing |
| Aspect Ratio | 8:1 |
| Silkscreen Color | White, Black, Yellow |
| Min Line Width | 5mil |
PCB Parameters
Number of Layers: 4
Brand: ONESEINE
Board thickness: 2+/-0.2mm
Size: 101.04mm*245.01mm
Material: Shengyi S1000-2
Minimum aperture: 0.2mm
Surface treatment: Immersion gold
Minimum hole copper: 25um
Table copper thickness: 2OZ
Minimum line width/spacing: 0.085mm/0.085mm
High Frequency PCB Material Inventory
| Brand | Model | Thickness(mm) | DK(ER) |
|---|---|---|---|
| Rogers | RO4003C | 0.203mm,0.305mm,0.406mm,0.508mm,0.813mm,1.524mm | 3.38 ± 0.05 |
| Rogers | RO4350B | 0.101mm,0.168mm,0.254mm,0.338mm,0.422mm,0.508mm,0.762mm,1.524mm | 3.48 ± 0.05 |
| Rogers | RO4360G2 | 0.203mm,0.305mm,0.406mm,0.508mm,0.610mm,0.813mm,1.524mm | 6.15 ± 0.15 |
High Frequency PCB Description
High-frequency PCB (Printed Circuit Board) refers to a type of PCB designed to handle high-frequency signals, typically in the radio frequency (RF) and microwave ranges. These PCBs are engineered to minimize signal loss, maintain signal integrity, and control impedance at high frequencies.
Key Features of High-Frequency PCBs
- Material Selection: Specialized materials with low dielectric constant (Dk) and low dissipation factor (Df)
- Controlled Impedance: Precise trace widths, spacing, and dielectric thickness
- Signal Integrity: Proper ground plane placement and signal return paths
- Transmission Lines: Microstrip or stripline geometries to control impedance
- Via Design: Techniques like back drilling or buried vias to minimize reflections
- Component Placement: Optimized to reduce parasitic capacitance and inductance
- Shielding: Copper pours, ground planes, or metal shielding cans to minimize EMI
High-frequency PCBs find applications in wireless communication systems, aerospace, radar systems, satellite communication, medical devices, and high-speed data transmission. Designing and manufacturing these PCBs requires specialized skills and knowledge to ensure optimal performance at high frequencies.
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