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Mettre en évidence
FPCA rigid flex circuit boards
,PET rigid flex circuit boards
,FPCA printed circuit board assembly
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Taille du PCBPersonnalisé
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Masque de soudureVert, rouge, bleu, noir, blanc
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Légendeblanc
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SocleCoutume
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Classe IPCClasse 2
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Type de matériau de raidisseurPI / FR4 / PET / PECIL
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Surface finieOr d'immersion
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Type de carteFPCA
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Place of OriginShenzhen,China
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Nom de marqueONESEINE
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CertificationISO9001,ISO14001
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Model NumberONE-102
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Minimum Order Quantity1pcs
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PrixUSD0.1-1000
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Packaging DetailsVacuun bag
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Delivery Time5-8 working days
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Payment TermsT/T, Western Union
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Supply Ability1000000000pcs/mon
Custom Rigid Flex PCB Board FR4 FPCA with Immersion Gold Finish
PET FR4 FPCA Printed Rigid Flex Circuit Boards Fabrication Assembly
Product Specifications
| Attribute | Value |
|---|---|
| Pcb Size | Customized |
| Solder Mask | Green, Red, Blue, Black, White |
| Legend | White |
| OEM | Custom |
| IPC Class | Class 2 |
| Stiffener Material Type | PI / FR4 / PET / Steel piece |
| Surface Finished | Immersion gold |
| Board Type | FPCA |
6 Layer Flex Rigid PCB Manufacturer FR4 Circuit Materials Fabrication
Material: Polymide flex FR4 rigid
Brand: Oneseine
Number of layers: 6
Board thickness: 1.6mm rigid & 0.2mm flex
Minimum aperture: 0.15mm
Minimum line width/line spacing: 0.08mm
Copper thickness: 1OZ each on the inner and outer layers
Solder resistance: green oil with white letters
Surface technology: sinking gold
Product features: 0.1mm hole to line, 0.2mm BGA pad, resin plug required for holes in the pad
Brand: Oneseine
Number of layers: 6
Board thickness: 1.6mm rigid & 0.2mm flex
Minimum aperture: 0.15mm
Minimum line width/line spacing: 0.08mm
Copper thickness: 1OZ each on the inner and outer layers
Solder resistance: green oil with white letters
Surface technology: sinking gold
Product features: 0.1mm hole to line, 0.2mm BGA pad, resin plug required for holes in the pad
Rigid-Flex PCB Applications in Smartphones and Tablets
Rigid-flex PCBs are extensively used in modern smartphones and tablets, enabling compact, lightweight, and flexible electronic assemblies that fit within slim, curved form factors.
Key Components Connected by Rigid-Flex PCBs:
- Processor and memory chips: Rigid sections provide stable mounting for main processor, RAM, and essential ICs
- Display and touch panel: Flexible portions allow seamless integration with edge-to-edge designs
- Camera module: Flexible sections enable optimal positioning in tight spaces
- Battery and peripherals: Ensures efficient power distribution and signal routing
This technology contributes to sleek, ergonomic designs while improving durability through shock and vibration absorption.
Rigid-Flex PCB Advantages
- Structural Integrity: Rigid sections provide stability while flexible portions allow bending and folding
- Space Optimization: Enables routing through tight spaces and complex 3D shapes
- Enhanced Reliability: Flexible sections better withstand bending and vibrations
- Manufacturing Efficiency: Automated fabrication reduces production costs
Manufacturing Process and Challenges
Production Steps:
- Multilayer lamination of rigid and flexible materials
- Rigid-flex structuring through selective etching
- Interconnect formation via vias and plated through-holes
- Circuit patterning using photolithography
- Component assembly and rigorous testing
Key Challenges:
- Thermal management in densely packed designs
- Balancing flexibility with long-term durability
- Maintaining dimensional stability during production
- Material compatibility to prevent delamination
- Achieving high-density miniaturization
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