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8 Layer Polyimide Rigid Flex PCB Board FR-4 Material

8 Layer Polyimide Rigid Flex PCB Board FR-4 Material

  • বিশেষভাবে তুলে ধরা

    Polyimide Flex PCB Board

    ,

    prototype Flex PCB Board

    ,

    8 Layer polyimide flex pcb

  • গুণ
    ১০০% পরীক্ষা
  • Min. মিন. Line Width/Spacing লাইন প্রস্থ/স্পেসিং
    0.০৭৫ মিমি
  • উপাদান
    FR-4, Polyimide, PET
  • মিন হোল সাইজ
    যান্ত্রিক গর্তঃ0.15mm
  • Min. মিন. hole size গর্তের আকার
    0.1 মিমি
  • আইটেম
    মাল্টিলেয়ার অনমনীয়/ফ্লেক্স পিসিবি প্রোটোটাইপ
  • স্তরের সংখ্যা
    ৮ স্তর
  • ফাইল ফরম্যাট
    গারবার ফাইল;প্যাক-এন-প্লেস ফাইল ((XYRS)
  • Place of Origin
    Shenzhen,China
  • পরিচিতিমুলক নাম
    ONESEINE
  • সাক্ষ্যদান
    ISO9001,ISO14001
  • Model Number
    ONE-102
  • Minimum Order Quantity
    1pcs
  • মূল্য
    USD0.1-1000
  • Packaging Details
    Vacuun bag
  • Delivery Time
    5-8 working days
  • Payment Terms
    T/T, Western Union
  • Supply Ability
    1000000000pcs/mon

8 Layer Polyimide Rigid Flex PCB Board FR-4 Material

Polyimide Rigid Flex PCB Board Prototype Production 8 Layer FR-4
Product Specifications
Attribute Value
Quality 100% test
Min. Line Width/Spacing 0.075mm
Material FR-4, Polyimide, PET
Min Hole Size Mechanical hole: 0.15mm
Min. Hole Size 0.1mm
Item Multilayer rigid/flex PCB prototype
Number Of Layers 8-Layer
File Formats Gerber Files; Pack-N-Place File (XYRS)
Flexible PCB Production: Overcoming Challenges with Rigid Flex PCB
Product Introduction
Application field: High level medical equipment
Material: Shengyi A-grade material + FPC flexible board
Number of layers: 6
Plate thickness: 2.0 ± 0.05mm
Minimum aperture: 0.1mm
Minimum line width/line spacing: 0.076mm
Copper thickness: 1OZ each on the inner and outer layers
Solder resistance: blue oil and white letters
Challenges in Flexible PCB Production
Producing Flexible Printed Circuits (FPCBs) involves several challenges that can impact quality, efficiency, and cost:
  • Material Selection: Finding high-quality flexible materials and ensuring compatibility between different materials
  • Design Complexity: Overcoming layout constraints and maintaining signal integrity in tight spaces
  • Manufacturing Processes: Achieving high precision in etching and maintaining precise layer alignment during lamination
  • Testing and Quality Assurance: Conducting rigorous reliability testing and overcoming inspection difficulties
  • Cost Management: Controlling higher production costs and minimizing material waste
  • Scalability: Maintaining quality when scaling up production and managing longer lead times
  • Environmental Factors: Addressing temperature sensitivity and ensuring chemical resistance for durability